05180
PKFC3.3C*
thru
PKFC36C*
PACKAGED FLIP CHIP ARRAY
APPLICATIONS
✔
Cellular Phones
✔
MCM Boards
✔
Wireless Communication Circuits
✔
IR LEDs
✔
SMART & PCMCIA Cards
IEC COMPATIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔
Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm)
✔
ESD Protection > 25 kilovolts
✔
Available in Voltages Ranging From 3.3V to 36V
✔
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 1 Line
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
✔
✔
✔
Encapsulated 0502 Chip
Weight 0.73 milligrams (Approximate)
Available in Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔
Consult Factory for Leaded Device Availability
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
PIN CONFIGURATION
05180.R4 2/07
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*PATENT PENDING
PKFC3.3C*
thru
PKFC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
A
T
STG
VALUE
250
-55 to 150
-55 to 150
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE
PART
NUMBER
(See Note 1)
DEVICE
MARKING
CODE
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
@ 25°C Unless Otherwise Specified
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
9.8
13.4
19.0
24.0
43.0
64.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
10***
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
PKFC3.3C
PKFC05C
PKFC08C
PKFC12C
PKFC15C
PKFC24C
PKFC36C
03
05
08
12
15
24
36
3.3
5.0
8.0
12.0
15.0
24.0
36.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@8/20µs
V
C
@ I
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
@0V, 1 MHz
C
pF
150
100
75
50
40
30
25
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
250W, 8/20µs Waveform
e
-t
100
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
05180.R4 2/07
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*PATENT PENDING
PKFC3.3C*
thru
PKFC36C*
GRAPHS
100
80
% Of Rated Power
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
60
40
20
Average Power
0
0
25
50
75
100
125
T
A
- Ambient Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
14
V
C
- Clamping Voltage - Volts
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
15
20
05180.R4 2/07
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*PATENT PENDING
PKFC3.3C*
thru
PKFC36C*
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05180.R4 2/07
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*PATENT PENDING
PKFC3.3C*
thru
PKFC36C*
0502 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
DIM
A
H
C
A
B
C
D
E
F
G
H
J
K
PACKAGE DIMENSIONS
MILLIMETERS
MIN
0.73
1.22
0.73
0.54
0.10
0.55
0.27
0.38
0.35
0.35
INCHES
MIN
0.029
0.048
0.029
0.021
0.004
0.022
0.011
0.015
0.014
0.014
NOM
0.76
1.27
0.76
0.57
0.13
0.58
0.30
0.41
0.38
0.38
MAX
0.79
1.32
0.79
0.60
0.16
0.61
0.33
0.44
0.41
0.41
NOM
0.030
0.050
0.030
0.023
0.005
0.023
0.012
0.016
0.015
0.015
MAX
0.031
0.052
0.031
0.024
0.006
0.024
0.013
0.017
0.016
0.016
D
K
TOP
B
BOTTOM
E
SIDE
J
F
G
NOTES
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad : ± 0.003” (± 0.08mm).
3. Maximum size: 0.052” (1.321mm) by 0.036” (0.914mm).
4. All dimensions ±0.003” on package outline.
MOUNTING PAD
A
PAD DIMENSIONS
DIM
A
B
C
E
F
G
J
MILLIMETERS
MIN
NOM
MAX
1.00
0.62
1.44
0.18
0.49
0.31
0.31
1.02
0.64
1.47
0.20
0.51
0.33
0.33
1.04
0.66
1.50
0.22
0.53
0.35
0.35
MIN
0.039
0.024
0.056
0.007
0.019
0.012
0.012
INCHES
NOM
MAX
0.040
0.025
0.058
0.008
0.020
0.013
0.013
0.041
0.026
0.060
0.009
0.021
0.014
0.014
G
B
F
E
C
TAPE & REEL ORIENTATION
Package Outline
J
XX
Solder Print Diameter
0.010” - 0.012”
TAPE & REEL ORDERING NOMENCLATURE
Package Contact Pads
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1).
3. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e.,
PKFC05C-LF-T75-1.
NOTE
1. Top view of tape. Solder PADS face down in tape package.
Outline & Dimensions: Rev 1 - 8/03, 06040
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
t
1.08 ± 0.05 1.60 ± 0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
E
Top cover tape
A0
K0
B0
F
W
P
User Direction of Feed
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
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