HD6433397B28FV datasheet, PDF - EEWORLD Datasheet

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HD6433397B28FV: DescriptionIC,MICROCONTROLLER,8-BIT,H8/300 CPU,CMOS,QFP,80PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，746 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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HD6433397B28FV Overview

IC,MICROCONTROLLER,8-BIT,H8/300 CPU,CMOS,QFP,80PIN,PLASTIC

HD6433397B28FV Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Renesas Electronics Corporation
package instruction	QFP, QFP80,.64SQ
Reach Compliance Code	unknown
bit size	8
CPU series	H8/300
JESD-30 code	S-PQFP-G80
Humidity sensitivity level	3
Number of terminals	80
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP80,.64SQ
Package shape	SQUARE
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	2048
rom(word)	61440
ROM programmability	MROM
speed	12 MHz
Maximum slew rate	45 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	QUAD
Base Number Matches	1

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To all our customers

Regarding the change of names mentioned in the document, such as

Hitachi Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were

transferred to Renesas Technology Corporation on April 1st 2003.

These operations include microcomputer, logic, analog and discrete devices,

and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors,

and other Hitachi brand names are mentioned in the document, these names

have in fact all been changed to Renesas Technology Corp.

Thank you for your understanding. Except for our corporate trademark,

logo and corporate statement, no changes whatsoever have been made to the

contents of the document, and these changes do not constitute any alteration

to the contents of the document itself.

Renesas Technology Home Page: www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Renesas Technology Corp.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or

use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that

demands especially high quality and reliability or where its failure or malfunction may directly

threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear

power, combustion control, transportation, traffic, safety equipment or medical equipment for

life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,

consider normally foreseeable failure rates or failure modes in semiconductor devices and

employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi

product does not cause bodily injury, fire or other consequential damage due to operation of

the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

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