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2170190-2

Description
SFP+ Enhanced 1x2, W/ High Heatsink
CategoryThe connector   
File Size856KB,17 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
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SFP+ Enhanced 1x2, W/ High Heatsink

2170190-2 Parametric

Parameter NameAttribute value
DimensionsSFP+
cage typeLinkage
Radiator includedyes
Connector Systemcable to board
Sealableno
Connectors and terminals terminate toA printed circuit board
Port matrix configuration1 x 2
Number of ports2
Data rate (max) (Gb/s)16
Radiator typePin
Radiator height10.5 mm [ .413 in ]
PCB Termination MethodsThrough hole - solderless connection
PCB installation methodThrough hole solderless connection
Connector mounting typeboard mounting
cage materialnickel silver
PCB thickness (recommended)2.25 mm [ .089 in ]
tail length2.05 mm [ .081 in ]
Working group temperature range-55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O productsSFP+ SMT connector
Pluggable I/O ApplicationsSFP+ enhanced
Circuit ApplicationSignal
Compatible radiatorsyes
Encapsulation methodPallets, boxes and pallets
EMI containment feature typesexternal spring
Light pipe includedno
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