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HI5960IB

Description
14-Bit, 125+MSPS, CommLinkTM High Speed D/A Converter
File Size588KB,12 Pages
ManufacturerIntersil ( Renesas )
Websitehttp://www.intersil.com/cda/home/
Download Datasheet View All

HI5960IB Overview

14-Bit, 125+MSPS, CommLinkTM High Speed D/A Converter

DATASHEET
HI5860
12-Bit, 130MSPS, High Speed D/A Converter
The HI5860 is a 12-bit, 130MSPS (Mega Samples Per
Second), high speed, low power, D/A converter which is
implemented in an advanced CMOS process. Operating
from a single +3V to +5V supply, the converter provides
20mA of full scale output current and includes
edge-triggered CMOS input data latches. Low glitch energy
and excellent frequency domain performance are achieved
using a segmented current source architecture.
This device complements the HI5x60 and HI5x28 family of high
speed converters, which includes 8-, 10-, 12-, and 14-bit
devices.
FN4654
Rev 7.00
February 6, 2008
Features
• Throughput Rate . . . . . . . . . . . . . . . . . . . . . . . . 130MSPS
• Low Power . . . 175mW at 5V, 32mW at 3V (At 100MSPS)
• Integral Linearity Error (Typ) . . . . . . . . . . . . . . . ±0.5 LSB
• Adjustable Full Scale Output Current . . . . . 2mA to 20mA
• Internal 1.2V Bandgap Voltage Reference
• Single Power Supply from +5V to +3V
• Power-Down Mode
• CMOS Compatible Inputs
Pinout
HI5860
(28 LD SOIC, TSSOP)
TOP VIEW
(MSB) D11
1
28 CLK
27 DV
DD
26 DCOM
25 ACOM
24 AV
DD
23 COMP2
22 IOUTA
21 IOUTB
20 ACOM
19 COMP1
18 FSADJ
17 REFIO
16 REFLO
15 SLEEP
• Excellent Spurious Free Dynamic Range
(76dBc, f
S
= 50MSPS, f
OUT
= 2.51MHz)
• Excellent Multitone Intermodulation Distortion
• Pb-Free Available (RoHS Compliant)
D10 2
D9 3
D8 4
D7 5
D6 6
D5 7
D4 8
D3 9
D2 10
D1 11
(LSB) D0 12
NC 13
NC 14
Applications
• Basestations (Cellular, WLL)
• Medical/Test Instrumentation
• Wireless Communications Systems
• Direct Digital Frequency Synthesis
• Signal Reconstruction
• High Resolution Imaging Systems
• Arbitrary Waveform Generators
Ordering Information
PART
NUMBER
HI5860IA*
HI5860IB
HI5860IBZ*
(Note)
HI5860SOICEVAL1
PART MARKING
HI5860 IA
HI5860IB
HI5860IBZ
TEMP. RANGE (°C)
-40 to +85
-40 to +85
-40 to +85
+25
PACKAGE
28 Ld TSSOP
28 Ld SOIC
28 Ld SOIC (Pb-free)
Evaluation Platform
PKG. DWG. #
M28.173
M28.3
M28.3
CLOCK SPEED
130MHz
130MHz
130MHz
130MHz
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
FN4654 Rev 7.00
February 6, 2008
Page 1 of 12
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