IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.048 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| method of packing | TAPE AND REEL |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 5.2 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 74FCT573ADCX | 54FCT573DMX | 54FCT573FMQR | 54FCT573AFMQR | 54FCT573LMQR | 54FCT573DMQR | 54FCT573ALMQR | 54FCT573ADMQR | 74FCT573ADCQR | 74FCT573PCX | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,FP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,LLCC,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,FCT/PCT-CMOS,DIP,20PIN,PLASTIC |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | R-XDFP-F20 | S-XQCC-N20 | R-XDIP-T20 | S-XQCC-N20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| MaximumI(ol) | 0.048 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.048 A | 0.048 A |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DFP | DFP | QCCN | DIP | QCCN | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | FL20,.3 | FL20,.3 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | NO | YES | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Prop。Delay @ Nom-Sup | 5.2 ns | 8.5 ns | 8.5 ns | - | 8.5 ns | 8.5 ns | - | - | 5.2 ns | 8 ns |
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