MSOP8 Thermal Resistance and Derating Information
MSOP8 1.1W devices (Single Die)
j-a=113°C/W Maximum
Mounted on a FR4 p.c.b.
of 25mm x 25mm with
high coverage of single
sided 1oz copper, in still
air conditions.
D=0.5
120
Thermal Resistance (°C/W)
100
80
60
40
D=0.2
Single Pulse
D=0.05
D=0.1
20
0
100µ
1m
10m
100m
1
10
100
1k
Pulse Width (s)
MSOP8 1.1W Derating (Single Die)
Transient Thermal Impedance
1.2
Max Power Dissipation (W)
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
160
MSOP8 0.87W Derating (One Active Die)
1.0
Max Power Dissipation (W)
Temperature (°C)
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
160
Derating Curve
MSOP8 0.87W devices (One Active Die)
Temperature (°C)
Derating Curve
140
120
100
80
60
40
20
0
100µ
1m
10m
100m
D=0.2
Single Pulse
D=0.05
D=0.1
D=0.5
j-a=143°C/W Maximum
One Active Die
Thermal Resistance (°C/W)
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
Microchip MCU
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