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S6B1713A05-B0CZ

Description
65 COM / 132 SEG DRIVER & CONTROLLER FOR STN LCD
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size435KB,70 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

S6B1713A05-B0CZ Overview

65 COM / 132 SEG DRIVER & CONTROLLER FOR STN LCD

S6B1713A05-B0CZ Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeDIE
package instructionDIE, DIE OR CHIP
Contacts324
Reach Compliance Codeunknow
ECCN codeEAR99
data entry modeSERIAL/PARALLEL
display modeDOT MATRIX
Interface integrated circuit typeLIQUID CRYSTAL DISPLAY DRIVER
JESD-30 codeR-XUUC-N324
Multiplex display functionNO
Number of base plates65-BP
Number of functions1
Number of segments198
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Encapsulate equivalent codeDIE OR CHIP
Package shapeRECTANGULAR
Package formUNCASED CHIP
power supply2.5/5 V
Certification statusNot Qualified
Maximum slew rate0.16 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.4 V
Nominal supply voltage3 V
Supply voltage 1-max15 V
Mains voltage 1-minute4 V
Supply voltage1-Nom8 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal locationUPPER
minfmax0.03 MHz
S6B1713
65 COM / 132 SEG DRIVER & CONTROLLER FOR STN LCD
March .2002
Ver. 4.2
Contents in this document are subject to change without notice. No part of this document may
be reproduced or transmitted in any form or by any means, electronic or mechanical, for any
purpose, without the express written permission of LCD Driver IC Team.
Precautions for Light
Light has characteristics to move electrons in the integrated circuitry of semiconductors,
therefore may change the characteristics of semiconductor devices when irradiated with light.
Consequently, the users of the packages which may expose chips to external light such as
COB, COG, TCP and COF must consider effective methods to block out light from reaching
the IC on all parts of the surface area, the top, bottom and the sides of the chip. Follow the
precautions below when using the products.
1.
Consider and verify the protection of penetrating light to the IC at substrate (
board or
glass) or product design stage.
Always test and inspect products under the environment with no penetration of light.
2.

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