Multilayer Ceramic Capacitors
X8R
Ordering code system
Chip
B37541
K
5
102
K
0
60
Packaging
60
62
70
72
^
^
^
^
cardboard tape, 180-mm reel
blister tape, 180-mm reel
cardboard tape, 330-mm reel
blister tape, 330-mm reel
Internal coding
Capacitance tolerance
J
^
±
5%
K
^
±
10 % (standard)
M
^
±
20 %
Capacitance,
coded
(example)
102
^
10 · 10
2
pF = 1 nF
103
^
10 · 10
3
pF = 10 nF
Rated voltage
Rated voltage [VDC]
Code
50
5
Termination
Standard:
On request:
K
^
nickel barrier for all case sizes
J
^
silver-palladium for conductive adhesion for all case sizes
Type and size
Chip size
(inch / mm)
0603
/ 1608
0805 /
2012
1206 /
3216
1210 /
3225
Temperature characteristic
X8R
B37531
B37541
B37472
B37550
70
10/02
Multilayer Ceramic Capacitors
X8R
Features
■
■
■
■
■
Chip
Wide temperature range up to 150
°
C
High volumetric efficiency
Non-linear capacitance change
High insulation resistance
High pulse strength
Applications
■
■
■
■
■
Automotive
Blocking
Coupling
Decoupling
Interference suppression
Termination
■
For soldering: Nickel-barrier terminations (Ni)
Options
■
Alternative capacitance tolerances available on request
Delivery mode
■
Cardboard and blister tape (blister tape for chip thickness
³
1,2
±
0,1 mm and case size 1210)
180-mm and 330-mm reel available
Electrical data
Temperature characteristic
Climatic category (IEC 60068-1)
Standard
Dielectric
Rated voltage
1)
Test voltage
Capacitance range / E series
Max. relative capacitance change
Dissipation factor (limit value)
Insulation resistance
2)
at + 25
°
C
Insulation resistance
2)
at +125
°
C
Time constant
2)
at + 25
°
C
Time constant
2)
at +125
°
C
Operating temperature range
Ageing
3)
X8R
55/150/56
EIA
Class 2
50
2,5 ·
V
R
/5 s
100 pF … 150 nF (E6)
±
15
< 25 · 10
–3
> 10
5
> 10
4
> 1000
> 100
–55 … +150
yes
V
R
V
test
C
R
D
C/C
tan
d
R
ins
R
ins
t
t
T
op
VDC
VDC
%
M
W
M
W
s
s
°
C
1) Note: No operation on AC line.
2) For
C
R
> 10 nF the time constant
t
=
C
·
R
ins
is given.
3) Refer to chapter “General Technical Information”, page 197.
71
10/02
Embedded System
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