TMS626412-10BDGE datasheet, PDF

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TMS626412-10BDGE: DescriptionIC,SDRAM,2X2MX4,CMOS,TSOP,44PIN,PLASTIC; Categorystorage storage; File Size3MB，39 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TMS626412-10BDGE Overview

IC,SDRAM,2X2MX4,CMOS,TSOP,44PIN,PLASTIC

TMS626412-10BDGE Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	TSOP, TSOP44,.46,32
Reach Compliance Code	not_compliant
Maximum access time	6 ns
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PDSO-G44
memory density	16777216 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	4
Number of terminals	44
word count	4194304 words
character code	4000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP
Encapsulate equivalent code	TSOP44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Continuous burst length	1,2,4,8
Maximum standby current	0.002 A
Maximum slew rate	0.12 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

TMS626412-10BDGE Related Products

	TMS626412-10BDGE	TMS626412-12BDGE	TMS626812-12BDGE	TMS626412-10ABDGE
Description	IC,SDRAM,2X2MX4,CMOS,TSOP,44PIN,PLASTIC	IC,SDRAM,2X2MX4,CMOS,TSOP,44PIN,PLASTIC	IC,SDRAM,2X1MX8,CMOS,TSOP,44PIN,PLASTIC	IC,SDRAM,2X2MX4,CMOS,TSOP,44PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	6 ns	8 ns	8 ns	6 ns
Maximum clock frequency (fCLK)	100 MHz	83 MHz	83 MHz	100 MHz
I/O type	COMMON	COMMON	COMMON	COMMON
interleaved burst length	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	4	4	8	4
Number of terminals	44	44	44	44
word count	4194304 words	4194304 words	2097152 words	4194304 words
character code	4000000	4000000	2000000	4000000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	4MX4	4MX4	2MX8	4MX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP	TSOP	TSOP	TSOP
Encapsulate equivalent code	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	4096	4096	4096	4096
Continuous burst length	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
Maximum standby current	0.002 A	0.002 A	0.002 A	0.002 A
Maximum slew rate	0.12 mA	0.11 mA	0.11 mA	0.12 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
package instruction	TSOP, TSOP44,.46,32	TSOP, TSOP44,.46,32	-	TSOP, TSOP44,.46,32

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