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5962-9065801LA

Description
4KX8 UVPROM, 70ns, CDIP24, CERAMIC, DIP-24
Categorystorage    storage   
File Size140KB,5 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

5962-9065801LA Overview

4KX8 UVPROM, 70ns, CDIP24, CERAMIC, DIP-24

5962-9065801LA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeDIP
package instructionCERAMIC, DIP-24
Contacts24
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time70 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T24
JESD-609 codee0
memory density32768 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals24
word count4096 words
character code4000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4KX8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum standby current0.035 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

5962-9065801LA Related Products

5962-9065801LA WS57C43C-70TMB 5962-9065801LX
Description 4KX8 UVPROM, 70ns, CDIP24, CERAMIC, DIP-24 4KX8 UVPROM, 70ns, CDIP24, 0.300 INCH, CERDIP-24 4KX8 UVPROM, 70ns, CDIP24, CERAMIC, DIP-24
Maker STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code DIP DIP DIP
package instruction CERAMIC, DIP-24 WDIP, DIP,
Contacts 24 24 24
Reach Compliance Code not_compliant unknown unknown
ECCN code EAR99 EAR99 EAR99
Maximum access time 70 ns 70 ns 70 ns
JESD-30 code R-GDIP-T24 R-GDIP-T24 R-GDIP-T24
memory density 32768 bit 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM UVPROM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 24 24 24
word count 4096 words 4096 words 4096 words
character code 4000 4000 4000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 4KX8 4KX8 4KX8
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DIP WDIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL DUAL
Base Number Matches 1 1 1
JESD-609 code e0 - e0
Terminal surface Tin/Lead (Sn/Pb) - hot dipped - TIN LEAD
Terminal pitch 2.54 mm 2.54 mm -
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