MX1N5253BUR-1 datasheet, PDF - EEWORLD Datasheet

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MX1N5253BUR-1: DescriptionZener Diode; CategoryDiscrete semiconductor diode; File Size281KB，6 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MX1N5253BUR-1 Overview

Zener Diode

MX1N5253BUR-1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	compli
ECCN code	EAR99
Diode type	ZENER DIODE
JESD-609 code	e0
Terminal surface	TIN LEAD
Base Number Matches	1

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1N5221BUR-1 thru 1N5281BUR-1

Available on

commercial

versions

METALLURGICALLY BONDED GLASS

SURFACE MOUNT 500 mW ZENERS

DESCRIPTION

Screening in

reference to

MIL-PRF-19500

available

The 1N5221BUR-1 thru 1N5281BUR-1 series of 0.5 watt Zener voltage regulators provides a

surface mount equivalent to the popular JEDEC registered 1N5221 to 1N5281 series for 2.4 to

200 volts in a metallurgically bonded configuration. They are available with standard 5% or

10% tolerances as well as tighter tolerances identified by different suffix letters on the part

number. Microsemi also offers numerous other Zener products to meet higher and lower

power applications.

Important:

For the latest information, visit our website

http://www.microsemi.com.

DO-213AA Package

FEATURES

•

Surface mount equivalent of JEDEC registered 1N5221 thru 1N5281 series.

Voltage tolerances of 10%, 5%, 2%, and 1% available.

Hermetically sealed surface mount package.

Internal metallurgical bond.

Up-screening in reference to MIL-PRF-19500 is available. (See

part nomenclature

for all available

options.)

RoHS compliant versions available (commercial grade only).

Also available in:

DO-35

(DO-204AH)

(axial-leaded)

1N5221B-1 thru 1N5281B-1

APPLICATIONS / BENEFITS

•

Regulates voltage over a broad operating current and temperature range.

Extensive selection from 2.4 to 200 V.

Non-sensitive to ESD (MIL-STD-750 method 1020).

Minimal capacitance (see

Figure 3).

Inherently radiation hard per Microsemi “MicroNote

050”.

MAXIMUM RATINGS

Parameters/Test Conditions

Junction and Storage Temperature

(1)

Thermal Resistance Junction-to-Ambient

Thermal Resistance Junction-to-End Cap

(2)

Steady-State Power Dissipation

Forward Voltage @ 200 mA

Solder Temperature @ 10 s

Symbol

and T

STG

ӨJA

ӨJEC

Value

-65 to +175

250

100

0.5

1.1

260

Unit

C/W

Notes:

1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).

2. At end cap temperature T

< 125

C or ambient temperature T

< 50

C when mounted on FR4 PC

board as described for thermal resistance above (see

Figure 2

for derating).

MSC – Lawrence

6 Lake Street,

Lawrence, MA 01841

Tel: 1-800-446-1158 or

(978) 620-2600

Fax: (978) 689-0803

MSC – Ireland

Gort Road Business Park,

Ennis, Co. Clare, Ireland

Tel: +353 (0) 65 6840044

Fax: +353 (0) 65 6822298

Website:

www.microsemi.com

T4-LDS-0232-1, Rev. 1 (111957)

Page 1 of 6

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