5962-89841093A datasheet, PDF - EEWORLD Datasheet

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5962-89841093A: DescriptionFlash PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28; CategoryProgrammable logic devices Programmable logic; File Size301KB，8 Pages; ManufacturerCypress Semiconductor

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5962-89841093A Overview

Flash PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28

5962-89841093A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	QLCC
package instruction	CERAMIC, LCC-28
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Architecture	PAL-TYPE
maximum clock frequency	50 MHz
JESD-30 code	S-CQCC-N28
JESD-609 code	e0
Dedicated input times	11
Number of I/O lines	10
Number of entries	22
Output times	10
Number of product terms	132
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	11 DEDICATED INPUTS, 10 I/O
Output function	MACROCELL
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Programmable logic type	FLASH PLD
propagation delay	15 ns
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
Base Number Matches	1

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Description	Flash PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28	EE PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28	Flash PLD, 10ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28	Flash PLD, 15ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24	Flash PLD, 15ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24	Flash PLD, 15ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QLCC	QLCC	QLCC	DFP	DFP	DIP
package instruction	CERAMIC, LCC-28	CERAMIC, LCC-28	CERAMIC, LCC-28	DFP, FL24,.4	DFP, FL24,.4	CERAMIC, DIP-24
Contacts	28	28	28	24	24	24
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Architecture	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE	PAL-TYPE
maximum clock frequency	50 MHz	50 MHz	76.9 MHz	50 MHz	50 MHz	50 MHz
JESD-30 code	S-CQCC-N28	S-CQCC-N28	S-CQCC-N28	R-GDFP-F24	R-GDFP-F24	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
Dedicated input times	11	11	11	11	11	11
Number of I/O lines	10	10	10	10	10	10
Number of entries	22	22	22	22	22	22
Output times	10	10	10	10	10	10
Number of product terms	132	132	132	132	132	132
Number of terminals	28	28	28	24	24	24
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O	11 DEDICATED INPUTS, 10 I/O
Output function	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL	MACROCELL
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	QCCN	QCCN	DFP	DFP	DIP
Encapsulate equivalent code	LCC28,.45SQ	LCC28,.45SQ	LCC28,.45SQ	FL24,.4	FL24,.4	DIP24,.3
Package shape	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	FLATPACK	FLATPACK	IN-LINE
Peak Reflow Temperature (Celsius)	240	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Programmable logic type	FLASH PLD	EE PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD
propagation delay	15 ns	15 ns	10 ns	15 ns	15 ns	15 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	NO LEAD	NO LEAD	NO LEAD	FLAT	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Base Number Matches	1	1	1	1	1	1
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	-	Cypress Semiconductor

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