The AG303-86 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG303-86 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
GND
4
RF In
1
3
RF Out
x
Green SOT-86 SMT Package
x
Internally matched to 50
:
2
GND
Applications
x
x
x
x
x
x
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output IP3
(2)
Output IP2
Output P1dB
Noise Figure
Test Frequency
Gain
Output IP3
(2)
Output P1dB
Device Voltage
Device Current
Typical Performance
(1)
Units
MHz
MHz
dB
dB
dB
dBm
dBm
dBm
dB
MHz
dB
dBm
dBm
V
mA
Min
DC
Typ
900
20.4
-22
-20
+14.0
+26.1
+34
3.0
1900
18.1
+24.8
+12.7
4.23
35
¡
Max
6000
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
21.1
-21
-22
+14.0
+26.4
2.9
Typical
900
20.4
-22
-20
+14.0
+26.1
3.0
1900
18.1
-26
-16
+12.7
+24.8
3.2
2140
17.5
-25
-16
+12.4
+24.4
3.2
17.1
19.1
1. Test conditions: T = 25º C, Supply Voltage = +5 V, R
bias
= 22.1 , 50 System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The suppression
on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. The junction temperature ensures a minimum MTTF rating of 1 million hours of usage.
Absolute Maximum Rating
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Parameter
-40 to +85
qC
-55 to +125
qC
+5 V
+10 dBm
+250q C
Rating
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc
Phone 1-800-WJ1-4401
¡
Ordering Information
Part No.
AG303-86*
AG303-86G
*
Description
(lead-tin SOT-86 Pkg)
InGaP HBT Gain Block
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 Pkg)
AG303-86PCB
This package is being phased out in favor of the green package type which is backwards compatible for
existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website.
700 – 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 1 of 6 June 2005
AG303-86
InGaP HBT Gain Block
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
21.4
-25
-19
+14.2
+26.5
2.9
500
21.1
-21
-22
+14.0
+26.4
2.9
¡
The Communications Edge
TM
Product Information
Supply Bias = +5 V, R
bias
= 22.1
:,
I
cc
= 35 mA
900
20.4
-22
-20
+14.0
+26.1
3.0
1900
18.1
-26
-16
+12.7
+24.8
3.2
¡
Typical Device RF Performance
2140
17.5
-25
-16
+12.4
+24.4
3.2
2400
16.9
-25
-15
+12.1
+23.9
3.2
3500
14.9
-25
-15
+9.3
5800
11.4
-25
-14
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = 4.23 V, Rbias = 22.1 , Icc = 35 mA typical, 50 System.
2. 3OIP measured with two tones at an output power of -2 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
24
22
Gain vs. Frequency
0
-10
-20
-30
S11
Return Loss
60
Device Current (mA)
50
40
30
20
10
0
3.0
3.5
I-V Curve
S11, S22 (dB)
Gain (dB)
20
18
16
14
12
0
-40 C
1
+25 C
+85 C
3
4
Optimal operating point
S22
-40
2
Frequency (GHz)
0
1
2
3
4
5
6
4.0
4.5
Frequency (GHz)
40
35
30
25
-40c
+25c
+85c
NF (dB)
Device Voltage (V)
30
25
20
15
Output IP3 vs. Frequency
Output IP2 vs. Frequency
5
4
3
2
1
0
Noise Figure vs. Frequency
OIP3 (dBm)
-40 C
+25 C
+85 C
OIP2 (dBm)
-40 C
+25 C
+85 C
10
20
0
0.5
1
1.5
2
2.5
3
0
200
400
600
800
1000
0
0.5
1
1.5
2
2.5
3
Frequency (GHz)
20
15
Gain (dB)
Frequency (MHz)
Output Power / Gain vs. Input Power
22
20
18
16
14
Gain
frequency = 900 MHz
Frequency (GHz)
Output Power / Gain vs. Input Power
20
O
utput Power (dBm
)
P1dB vs. Frequency
18
16
Gain (dB)
frequency = 2000 MHz
16
O
utput Power (dBm
)
P1dB (dBm)
16
12
8
4
Output Power
0
0
4
Gain
12
8
4
0
Output Power
-4
0
4
10
5
-40 C
+25 C
+85 C
14
12
10
8
-20
0
0
0.5
1
1.5
2
2.5
3
3.5
4
Frequency (GHz)
12
-20
-16
-12
-8
-4
Input Power (dBm)
-16
-12
-8
-4
Input Power (dBm)
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 2 of 6 June 2005
AG303-86
InGaP HBT Gain Block
24
22
Gain vs. Frequency
The Communications Edge
TM
Product Information
Typical Device RF Performance (cont’d)
Supply Bias = +6 V, R
bias
= 51
:,
I
cc
= 35 mA
30
25
20
15
-40 C
+25 C
+85 C
Output IP3 vs. Frequency
40
35
30
25
Output IP2 vs. Frequency
18
16
14
12
0
-40 C
1
+25 C
+85 C
3
4
OIP3 (dBm)
Gain (dB)
20
OIP2 (dBm)
-40c
+25c
+85c
10
20
2
Frequency (GHz)
0
0.5
1
1.5
2
2.5
3
0
200
400
600
800
1000
Frequency (GHz)
P1dB vs. Frequency
Frequency (MHz)
Noise Figure vs. Frequency
20
15
10
5
5
4
NF (dB)
P1dB (dBm)
3
2
1
0
-40 C
+25 C
+85 C
-40 C
+25 C
+85 C
0
0
0.5
1
1.5
2
2.5
3
3.5
4
Frequency (GHz)
0
0.5
1
1.5
2
2.5
3
Frequency (GHz)
Supply Bias = +8 V, R
bias
= 108
:,
I
cc
= 35 mA
24
22
Gain vs. Frequency
Typical Device RF Performance
30
25
20
15
-40 C
+25 C
+85 C
Output IP3 vs. Frequency
40
35
30
25
Output IP2 vs. Frequency
18
16
14
12
0
-40 C
1
+25 C
+85 C
3
4
OIP3 (dBm)
Gain (dB)
20
OIP2 (dBm)
-40c
+25c
+85c
10
20
2
Frequency (GHz)
0
0.5
1
1.5
2
2.5
3
0
200
400
600
800
1000
Frequency (GHz)
P1dB vs. Frequency
Frequency (MHz)
Noise Figure vs. Frequency
20
15
10
5
5
4
NF (dB)
P1dB (dBm)
3
2
1
0
-40 C
+25 C
+85 C
-40 C
+25 C
+85 C
0
0
0.5
1
1.5
2
2.5
3
3.5
4
Frequency (GHz)
0
0.5
1
1.5
2
2.5
3
Frequency (GHz)
Specifications and information are subject to change without notice
¢
¢
¢
¢
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 3 of 6 June 2005
AG303-86
InGaP HBT Gain Block
Vcc
Icc = 35 mA
The Communications Edge
TM
Product Information
Application Circuit
R1
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
AG303-86
C1
Blocking
Capacitor
C2
Blocking
Capacitor
RF OUT
Recommended Component Values
Reference
Designator
50
500
L1
820 nH
220 nH
C1, C2, C4
.018 µF
1000 pF
Ref. Desig.
L1
C1, C2
C3
C4
R1
Frequency (MHz)
900
1900
2200
68 nH
27 nH
22 nH
100 pF
68 pF
68 pF
Size
0603
0603
0603
0603
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
PF
chip capacitor
Do Not Place
22.1
:
1% tolerance
Recommended Bias Resistor Values
S upply
R1 value
S ize
Voltage
5V
22.1 ohms
0603
6V
51 ohms
0805
7V
80 ohms
1206
8V
108 ohms
1210
9V
137 ohms
1210
166 ohms
1210
10 V
223 ohms
2010
12 V
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
Typical Device Data
S-Parameters (V
device
= +4.23 V, I
CC
= 35 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
3250
3500
3750
4000
4250
4500
4750
5000
5250
5500
5750
6000
-25.41
-178.61
21.90
177.08
-24.39
2.68
-19.43
-24.87
155.73
21.78
166.27
-24.78
2.50
-19.45
-21.45
140.47
21.52
152.92
-24.79
0.95
-22.15
-21.60
121.87
21.11
140.36
-24.66
-0.65
-20.82
-22.37
104.08
20.62
128.55
-24.69
-0.47
-19.91
-22.85
90.28
20.09
117.05
-24.39
0.10
-18.42
-23.73
71.50
19.48
106.85
-23.69
0.62
-17.78
-25.75
49.04
18.90
96.96
-23.87
-1.60
-16.51
-25.80
20.48
18.25
87.61
-23.36
-1.98
-16.04
-20.60
4.51
17.68
79.42
-23.35
-1.35
-14.44
-21.35
-10.34
17.27
73.31
-23.42
-5.50
-14.66
-21.07
-27.85
16.73
64.91
-22.38
-6.48
-14.71
-20.28
-38.57
16.22
57.01
-22.30
-5.72
-15.40
-20.61
-43.39
15.75
49.56
-22.06
-7.56
-16.08
-21.43
-46.83
15.30
42.14
-21.79
-9.98
-16.63
-23.21
-45.68
14.83
34.70
-21.14
-14.32
-16.45
-25.23
-33.68
14.43
27.45
-21.01
-19.42
-15.95
-27.97
-14.82
14.02
20.33
-20.54
-19.39
-14.63
-28.62
21.21
13.56
13.29
-19.99
-23.59
-13.70
-28.24
50.04
13.16
5.94
-19.74
-27.50
-12.98
-27.40
61.17
12.84
-0.90
-19.45
-32.13
-12.53
-32.61
78.84
12.46
-7.21
-19.53
-34.94
-12.98
-38.22
144.81
12.12
-13.47
-19.19
-37.72
-13.34
-28.58
-149.36
11.86
-19.80
-18.83
-41.09
-14.62
-24.71
-137.35
11.61
-26.11
-18.61
-44.88
-15.38
Device S-parameters are available for download off of the website at: http://www.wj.com
Phone 1-800-WJ1-4401
£
£
£
£
WJ Communications, Inc
FAX: 408-577-6621
¤
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
-6.66
-23.90
-58.28
-83.69
-103.53
-120.77
-130.98
-140.18
-146.19
-135.98
-143.15
-151.02
-161.21
-172.88
172.37
152.74
135.04
121.85
110.85
104.47
101.02
97.98
99.21
100.79
100.73
S22 (ang)
Specifications and information are subject to change without notice
e-mail: sales@wj.com
Web site: www.wj.com
Page 4 of 6 June 2005
AG303-86
InGaP HBT Gain Block
The Communications Edge
TM
Product Information
AG303-86 (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an “E”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
Class 1C
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Level 4
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern
MSL Rating: Level 1
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135” )
diameter drill and have a final plated thru diameter of .25 mm
(.010” ).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
-40 to +85
qC
335
qC/W
135
qC
Rating
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
¤
¤
Specifications and information are subject to change without notice
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