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5962-9471604H9X

Description
Flash Module, 128KX32, 70ns, CQFP68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Categorystorage    storage   
File Size388KB,16 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9471604H9X Overview

Flash Module, 128KX32, 70ns, CQFP68, 23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

5962-9471604H9X Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction23.90 X 23.90 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Codeunknown
Maximum access time70 ns
Other featuresALSO CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQFP-G68
JESD-609 codee4
length23.88 mm
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFP
Package shapeSQUARE
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Programming voltage5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height3.56 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width23.88 mm
Base Number Matches1
White Electronic Designs
FEATURES
n
n
WF128K32-XXX5
128K
X
32 5V FLASH MODULE, SMD 5962-94716
Access Times of 50*, 60, 70, 90, 120, 150ns
Packaging:
• 66 pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400)
•
68 lead, Hermetic CQFP (G2U), 22.4mm (0.880
inch) square, 3.56mm (0.140 inch) high
(Package 510)
68 lead, Hermetic CQFP (G2L), 22.4mm (0.880
inch) square, 4.06mm (0.160 inch) high (Pack
age 528)
n
100,000 Erase/Program Cycles Typical, 0°C to +70°C
n
n
n
n
n
Organized as 128Kx32
Commercial, Industrial and Military Temperature
Ranges
5 Volt Programming. 5V ± 10% Supply
Embedded Erase and Program Algorithms
TTL Compatible Inputs and CMOS Outputs
Pins for Low Noise Operation
Control Time
n
Low Power CMOS, 1mA Standby Typical
•
n
Built-in Decoupling Caps and Multiple Ground
n
Page Program Operation and Internal Program
n
• 68 lead, Hermetic CQFP (G1U)
1
, 23.9mm (0.940
inch) square, 3.56mm (0.140 inch) high
(Package 519)
• 68 lead, Hermetic CQFP (G1T), 23.9mm (0.940
inch) square, 4.06mm (0.160 inch) high
(Package 524)
n
Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
Weight
WF128K32-XG2LX5 - 8 grams typical
WF128K32-XG1UX5
1
- 5 grams typical
WF128K32-XG1TX5 - 5 grams typical
WF128K32-XG2UX5 - 8 grams typical
WF128K32-XH1X5 - 13 grams typical
Note 1: Package Not Recommended For New Design
Note: For programming information refer to Flash Programming 1M5
Application Note.
* The access time of 50ns is available in Industrial and Commercial
temperature ranges only.
FIG. 1
PIN CONFIGURATION FOR WF128K32N-XH1X5
TOP VIEW
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
WE
2
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
NC
I/O
3
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
V
CC
CS
4
WE
4
I/O
27
A
4
A
5
A
6
WE
3
CS
3
GND
I/O
19
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
PIN DESCRIPTION
I/O
0-31
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
May 2003 Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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