74F407SC datasheet, PDF - EEWORLD Datasheet

74F407SC: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, SOIC-24; CategoryThe embedded processor and controller Microcontrollers and processors; File Size466KB，7 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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74F407SC Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, SOIC-24

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	SOP,
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G24
JESD-609 code	e0
length	15.4 mm
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.5 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

	74F407SC	74F407SDC	74F407SPC	74F407SPCQR
Description	SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, SOIC-24	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24	SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24	IC,REGISTER FILE,F-TTL,DIP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	SOP,	DIP,	DIP,	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G24	R-GDIP-T24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0
Number of terminals	24	24	24	24
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
surface mount	YES	NO	NO	NO
technology	BIPOLAR	TTL	TTL	TTL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1
length	15.4 mm	32.77 mm	30.095 mm	-
Maximum seat height	2.65 mm	5.08 mm	5.08 mm	-
width	7.5 mm	7.62 mm	7.62 mm	-
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	-

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