54AC708FM datasheet, PDF - EEWORLD Datasheet

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54AC708FM: DescriptionIC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC; Categorystorage storage; File Size1MB，18 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54AC708FM Overview

IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC

54AC708FM Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	DFP, FL28,.4
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F28
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	28
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X9
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL28,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	3.3/5 V
Certification status	Not Qualified
Maximum standby current	0.01 A
Maximum slew rate	0.15 mA
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

54AC708FM Related Products

	54AC708FM	54AC708DM	74AC708QC	54AC708LM
Description	IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC	IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,DIP,28PIN,CERAMIC	IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,LDCC,28PIN,PLASTIC	IC,FIFO,64X9,ASYNCHRONOUS,AC-CMOS,LLCC,28PIN,CERAMIC
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DFP, FL28,.4	DIP, DIP28,.6	QCCJ, LDCC28,.5SQ	QCCN, LCC28,.45SQ
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F28	R-XDIP-T28	S-PQCC-J28	S-XQCC-N28
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9
Number of terminals	28	28	28	28
word count	64 words	64 words	64 words	64 words
character code	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-55 °C
organize	64X9	64X9	64X9	64X9
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DFP	DIP	QCCJ	QCCN
Encapsulate equivalent code	FL28,.4	DIP28,.6	LDCC28,.5SQ	LCC28,.45SQ
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK	IN-LINE	CHIP CARRIER	CHIP CARRIER
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.01 A	0.01 A	0.01 A	0.01 A
Maximum slew rate	0.15 mA	0.15 mA	0.15 mA	0.15 mA
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	MILITARY
Terminal form	FLAT	THROUGH-HOLE	J BEND	NO LEAD
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	QUAD

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