5962-8986301XX datasheet, PDF - EEWORLD Datasheet

5962-8986301XX: DescriptionFIFO, 512X9, 80ns, Asynchronous, CMOS, 1.490 X 0.610 INCH, 0.232 INCH HIEGHT, DIP-28; Categorystorage storage; File Size440KB，13 Pages; ManufacturerIDT (Integrated Device Technology)

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5962-8986301XX Overview

FIFO, 512X9, 80ns, Asynchronous, CMOS, 1.490 X 0.610 INCH, 0.232 INCH HIEGHT, DIP-28

Parameter Name	Attribute value
Maker	IDT (Integrated Device Technology)
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	80 ns
Other features	RETRANSMIT
period time	100 ns
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
length	37.211 mm
memory density	4608 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X9
Exportable	NO
Package body material	UNSPECIFIED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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