2SK3932-01MR
N-CHANNEL SILICON POWER MOSFET
Outline Drawings
(mm)
TO-220F
200406
FUJI POWER MOSFET
Super FAP-G Series
Features
High speed switching
No secondary breadown
Avalanche-proof
Low on-resistance
Low driving power
Applications
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristic
Absolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Continuous Drain Current
Pulsed Drain Current
Gate-Source Voltage
Maximum Avalanche current
Non-Repetitive
Maximum Avalanche Energy
Repetitive
Maximum Avalanche Energy
Maximum Drain-Source dV/dt
Peak Diode Recovery dV/dt
Max. Power Dissipation
Operating and Storage
Temperature range
Isolation Voltage
Symbol
V
DS
V
DSX
I
D
I
D(puls]
V
GS
I
AR
E
AS
E
AR
dV
DS
/dt
dV/dt
P
D
T
ch
T
stg
V
ISO
Ratings
500
500
11
±44
±30
11
453.9
6.0
20
5
60
2.16
+150
-55 to +150
2
Unit
V
V
A
A
V
A
mJ
mJ
Remarks
V
GS
=-30V
Equivalent circuit schematic
Drain(D)
Note *1
Note *2
Note *3
Gate(G)
Source(S)
Note *1:Tch < 150°C,Repetitive and Non-repetitive
=
Note *2:StartingTch=25°C,I
AS
=4.4A,L=43mH,
V
CC
=50V,R
G
=50Ω
kV/µs V
DS
< 500V
=
EAS limited by maximum channel temperature
kV/µs Note *4
and avalanch current.
Tc=25°C
W
See to the ‘Avalanche Energy’ graph
Ta=25°C
Note *3:Repetitive rating:Pulse width limited by
°C
maximum channel temperature.
°C
See to the ‘Transient Theemal impedance’
kVrms t=60sec, f=60Hz
graph
Note *4:I
F
< -I
D
, -di/dt=50A/
µ
s,V
CC
< BV
DSS
,Tch< 150°C
=
=
=
Electrical characteristics (T
c
=25°C unless otherwise specified)
Item
Drain-Source Breakdown Voltaget
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage Current
Drain-Source On-State Resistance
Forward Transcondutance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-On Time t
on
Turn-Off Time t
off
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Symbol
BV
DSS
V
GS(th)
I
DSS
I
GSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
td
(on)
t
r
td
(off)
t
f
Q
G
Q
GS
Q
GD
V
SD
t
rr
Q
rr
Symbol
R
th(ch-c)
R
th(ch-a)
Test Conditions
I
D
= 250µA
V
GS
=0V
µA
I
D
= 250
V
DS
=V
GS
T
ch
=25°C
V
DS
=500V V
GS
=0V
T
ch
=125°C
V
DS
=400V V
GS
=0V
V
GS
=±30V V
DS
=0V
I
D
=5.5A V
GS
=10V
I
D
=5.5A V
DS
=25V
V
DS
=25V
V
GS
=0V
f=1MH
V
CC
=300V I
D
=5.5A
V
GS
=10V
R
GS
=10
Ω
V
CC
=250V
I
D
=11A
V
GS
=10V
I
F
=11A V
GS
=0V T
ch
=25°C
I
F
=11A V
GS
=0V
-di/dt=100A/µs T
ch
=25°C
Test Conditions
channel to case
channel to ambient
Min.
500
3.0
Typ.
Max.
5.0
25
250
100
0.70
Units
V
V
µA
µA
nA
Ω
S
pF
4.5
10
0.57
9.0
950
1425
130
195
6.0
9.0
16
24
6.0
9.0
33
50
5.5
8.3
25
38
10
15
8.0
12
1.10
1.50
650
5.5
ns
nC
V
ns
µC
Thermalcharacteristics
Item
Thermal resistance
www.fujielectric.co.jp/fdt/scd
Min.
Typ.
Max.
2.083
58
Units
°C/W
°C/W
1
2SK3932-01MR
Characteristics
Allowable Power Dissipation
PD=f(Tc)
FUJI POWER MOSFET
80
30
Typical Output Characteristics
ID=f(VDS):80
µ
s pulse test,Tch=25
°
C
20V
70
25
60
20
50
10V
8.0V
PD [W]
40
ID [A]
7.0V
15
30
10
20
5
10
VGS=6.0V
6.5V
0
0
25
50
75
100
125
150
0
0
5
10
15
20
25
30
35
40
Tc [
°
C]
VDS [V]
100
Typical Transfer Characteristic
ID=f(VGS):80
µ
s pulse test,VDS=25V,Tch=25
°
C
100
Typical Transconductance
gfs=f(ID):80
µ
s pulse test,VDS=25V,Tch=25
°
C
10
10
ID[A]
1
1
0.1
0.1
0
1
2
3
4
5
6
7
8
9
10
0.1
1
10
100
VGS[V]
gfs [S]
ID [A]
2.0
1.8
1.6
1.4
Typical Drain-Source on-state Resistance
RDS(on)=f(ID):80
µ
s pulse test,Tch=25
°
C
VGS=6.0V
6.5V
7.0V
2.0
1.8
1.6
1.4
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=5.5A,VGS=10V
RDS(on) [
Ω
]
1.2
1.0
0.8
0.6
0.4
0.2
0.0
RDS(on) [
Ω
]
8.0V 10V
20V
1.2
1.0
max.
0.8
0.6
0.4
0.2
0.0
typ.
0
5
10
15
20
25
30
-50
-25
0
25
50
75
100
125
150
ID [A]
Tch [
°
C]
2
2SK3932-01MR
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250
µ
A
FUJI POWER MOSFET
7.0
6.5
6.0
5.5
5.0
14
Typical Gate Charge Characteristics
VGS=f(Qg):ID=11A,Tch=25
°
C
12
Vcc= 100V
max.
10
250V
400V
8
VGS(th) [V]
4.5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
125
150
min.
VGS [V]
4.0
6
4
2
0
0
10
20
30
40
Tch [
°
C]
Qg [nC]
10
4
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
100
Typical Forward Characteristics of Reverse Diode
IF=f(VSD):80
µ
s pulse test,Tch=25
°
C
Ciss
10
3
10
C [pF]
10
2
Coss
IF [A]
1
0.1
0.00
10
1
Crss
10
0
10
-1
10
0
10
1
10
2
10
3
0.25
0.50
0.75
1.00
1.25
1.50
VDS [V]
VSD [V]
10
3
Typical Switching Characteristics vs. ID
t=f(ID):Vcc=300V,VGS=10V,RG=10
Ω
500
450
400
350
Maximum Avalanche Energy vs. starting Tch
E(AV)=f(starting Tch):Vcc=50V
I
AS
=4.4A
10
2
tf
td(off)
300
I
AS
=6.6A
EAV [mJ]
t [ns]
250
200
150
I
AS
=11A
td(on)
10
1
tr
100
50
10
0
0
-1
10
10
0
10
1
10
2
0
25
50
75
100
125
150
ID [A]
starting Tch [
°
C]
3
Embedded System
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