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5962-8873503LX

Description
OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
Categorystorage    storage   
File Size295KB,11 Pages
ManufacturerCypress Semiconductor
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5962-8873503LX Overview

OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24

5962-8873503LX Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-GDIP-T24
memory density16384 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristicsREGISTERED
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Programming voltage12.5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum standby current0.12 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

5962-8873503LX Related Products

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Description OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 UVPROM, 2KX8, 12ns, CMOS, CQCC28, WINDOWED, LCC-28 UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 UVPROM, 2KX8, 15ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 OTP ROM, 2KX8, 15ns, CMOS, CQCC28, LCC-28 UVPROM, 2KX8, 25ns, CMOS, CQCC28, WINDOWED, LCC-28 UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24
Parts packaging code DIP QLCC DIP DIP DIP QLCC QLCC DIP
package instruction DIP, DIP24,.3 QCCN, LCC28,.45SQ DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 QCCN, LCC28,.45SQ QCCN, LCC28,.45SQ DIP,
Contacts 24 28 24 24 24 28 28 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 25 ns 12 ns 25 ns 25 ns 15 ns 15 ns 25 ns 12 ns
JESD-30 code R-GDIP-T24 S-CQCC-N28 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24 S-CQCC-N28 S-CQCC-N28 R-GDIP-T24
memory density 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type OTP ROM UVPROM UVPROM UVPROM UVPROM OTP ROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 24 28 24 24 24 28 28 24
word count 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000 2000 2000 2000 2000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8 2KX8
Package body material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
encapsulated code DIP QCCN DIP DIP DIP QCCN QCCN DIP
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO NO NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE
Terminal location DUAL QUAD DUAL DUAL DUAL QUAD QUAD DUAL
Base Number Matches 1 1 1 1 1 1 1 1
Maker Cypress Semiconductor - Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor Cypress Semiconductor
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON -
Output characteristics REGISTERED REGISTERED REGISTERED REGISTERED REGISTERED REGISTERED REGISTERED -
Encapsulate equivalent code DIP24,.3 LCC28,.45SQ DIP24,.3 DIP24,.3 DIP24,.3 LCC28,.45SQ LCC28,.45SQ -
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V -
Programming voltage 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V 12.5 V -
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B -
Maximum standby current 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A -
Maximum slew rate 0.12 mA 0.12 mA 0.12 mA 0.12 mA 0.12 mA 0.12 mA 0.12 mA -
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm -
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