OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T24 |
| memory density | 16384 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Output characteristics | REGISTERED |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Programming voltage | 12.5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum standby current | 0.12 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 5962-8873503LX | 5962-89815033X | 5962-8981501LX | 5962-8981501LXP | 5962-8981502LX | 5962-88735043X | 5962-89815013X | 5962-8981503LX | |
|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 | UVPROM, 2KX8, 12ns, CMOS, CQCC28, WINDOWED, LCC-28 | UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 | UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 | UVPROM, 2KX8, 15ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 | OTP ROM, 2KX8, 15ns, CMOS, CQCC28, LCC-28 | UVPROM, 2KX8, 25ns, CMOS, CQCC28, WINDOWED, LCC-28 | UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMETIC SEALED, CERDIP-24 |
| Parts packaging code | DIP | QLCC | DIP | DIP | DIP | QLCC | QLCC | DIP |
| package instruction | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIP, |
| Contacts | 24 | 28 | 24 | 24 | 24 | 28 | 28 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 12 ns | 25 ns | 25 ns | 15 ns | 15 ns | 25 ns | 12 ns |
| JESD-30 code | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-GDIP-T24 |
| memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | OTP ROM | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 28 | 24 | 24 | 24 | 28 | 28 | 24 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | QCCN | DIP | DIP | DIP | QCCN | QCCN | DIP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | NO | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Maker | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - |
| Output characteristics | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | REGISTERED | - |
| Encapsulate equivalent code | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | - |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| Programming voltage | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | - |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - |
| Maximum standby current | 0.12 A | 0.12 A | 0.12 A | 0.12 A | 0.12 A | 0.12 A | 0.12 A | - |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.12 mA | - |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |