54F257/BEAJC datasheet, PDF - EEWORLD Datasheet

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54F257/BEAJC: DescriptionIC,LOGIC MUX,QUAD,2-INPUT,F-TTL,DIP,16PIN,CERAMIC; Categorylogic logic; File Size208KB，5 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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54F257/BEAJC Overview

IC,LOGIC MUX,QUAD,2-INPUT,F-TTL,DIP,16PIN,CERAMIC

54F257/BEAJC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Logic integrated circuit type	MULTIPLEXER
MaximumI(ol)	0.024 A
Number of functions	4
Number of entries	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum supply current (ICC)	23 mA
Prop。Delay @ Nom-Sup	15.5 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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54F257/BEAJC Related Products

	54F257/BEAJC	54F257M/B2AJC	54F257A/BFAJC	MC74F257DR2
Description	IC,LOGIC MUX,QUAD,2-INPUT,F-TTL,DIP,16PIN,CERAMIC	IC,LOGIC MUX,QUAD,2-INPUT,F-TTL,LLCC,20PIN,CERAMIC	IC,LOGIC MUX,QUAD,2-INPUT,F-TTL,FP,16PIN,CERAMIC	IC,LOGIC MUX,QUAD,2-INPUT,F-TTL,SOP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP	NXP
package instruction	DIP, DIP16,.3	QCCN, LCC20,.35SQ	DFP, FL16,.3	SOP, SOP16,.25
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T16	S-XQCC-N20	R-XDFP-F16	R-PDSO-G16
JESD-609 code	e0	e0	e0	e0
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
MaximumI(ol)	0.024 A	0.024 A	0.02 A	0.024 A
Number of functions	4	4	4	4
Number of entries	2	2	2	2
Number of terminals	16	20	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	QCCN	DFP	SOP
Encapsulate equivalent code	DIP16,.3	LCC20,.35SQ	FL16,.3	SOP16,.25
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	FLATPACK	SMALL OUTLINE
power supply	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	23 mA	23 mA	23 mA	23 mA
Prop。Delay @ Nom-Sup	15.5 ns	15.5 ns	11.5 ns	15 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES
technology	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	NO LEAD	FLAT	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
Base Number Matches	1	1	1	1
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-

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