EEWORLDEEWORLDEEWORLD

Part Number

Search

5768A

Description
Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options
CategoryDiscrete semiconductor    diode   
File Size54KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

5768A Overview

Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options

5768A Parametric

Parameter NameAttribute value
package instructionR-CDFP-F10
Contacts10
Reach Compliance Codecompli
ECCN codeEAR99
ConfigurationCOMMON CATHODE, 8 ELEMENTS
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)1 V
JESD-30 codeR-CDFP-F10
JESD-609 codee0
Number of components8
Number of terminals10
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Maximum output current0.3 A
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formFLATPACK
Maximum power dissipation0.5 W
Certification statusNot Qualified
GuidelineIEC-61000-4-2; IEC-61000-4-4, 4-5
Maximum reverse current0.1 µA
Maximum reverse recovery time0.02 µs
Reverse test voltage40 V
surface mountYES
Terminal surfaceTIN LEAD
Terminal formFLAT
Terminal locationDUAL
Base Number Matches1
5770A
Isolated Diode Array with
HiRel MQ, MX, MV, and SP Screening Options
SCOTTSDALE DIVISION
DESCRIPTION
These low capacitance diode arrays with common anode are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 10-PIN package for use as
steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing
them to ground (see figure 1). This circuit application is further complimented by the
1N5768 (separate data sheet) that has a common cathode. An external TVS diode may
be added between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver applications. This
includes computers and peripheral equipment such as magnetic cores, thin-film
memories, plated-wire memories, etc., as well as decoding or encoding applications.
These arrays offer many advantages of integrated circuits such as high-density
packaging and improved reliability. This is a result of fewer pick and place operations,
smaller footprint, smaller weight, and elimination of various discrete packages that may
not be as user friendly in PC board mounting.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
10-PIN Ceramic
Flat Pack
FEATURES
Hermetic Ceramic Package
Isolated Diodes To Eliminate Cross-Talk Voltages
High Breakdown Voltage V
BR
> 60 V at 10
μA
Low Leakage I
R
< 100nA at 40 V
Low Capacitance C < 8.0 pF
Options for screening in accordance with MIL-PRF-
19500/474 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or SP prefixes
respectively to part numbers. For example, designate
MX5770A for a JANTX screen.
APPLICATIONS / BENEFITS
High Frequency Data Lines
RS-232 & RS-422 Interface Networks
Ethernet: 10 Base T
Computer I/O Ports
LAN
Switching Core Drivers
IEC 61000-4 Compatible (see circuit in figure 1)
61000-4-2 ESD : Air 15kV, contact 8kW
61000-4-4 (EFT) : 40A – 5/50 ns
61000-4-5 (surge): 12A 8/20
μs
MAXIMUM RATINGS
V
BR
Reverse Breakdown Voltage 60 V min (Notes 1 & 2)
I
O
Continuous Forward Current 300 mA (Notes 1 & 3)
I
FSM
Forward Surge Current (tp=1/120 s) 500 mA (Note 1)
o
400 mW Power Dissipation per Junction @ 25 C
500 mW Power Dissipation per Package @ 25
o
C (Note 4)
o
Operating Junction Temperature range –65 to +150 C
Storage Temperature range of –65 to +150
o
C
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
Each Diode
Pulsed: P
W
= 100 ms max; duty cycle <20%
o
o
Derate at 2.4 mA/ C above +25 C
o
o
Derate at 4.0 mW/ C above +25 C
MECHANICAL AND PACKAGING
10-PIN Ceramic Flat Pack
Weight 0.25 grams (approximate)
Marking: Logo, part number, date code and dot
identifying pin #1
Carrier Tubes; 19 pcs (standard)
PART
NUMBER
MAXIMUM
FORWARD
VOLTAGE
V
F1
I
F
= 100 mA
(Note 1)
Vdc
MAXIMUM
REVERSE
CURRENT
I
R1
V
R
= 40 V
μAdc
MAXIMUM
CAPACITANCE
(PIN TO PIN)
MAXIMUM
FORWARD
RECOVERY TIME
t
fr
I
F
= 500 mA
ns
C
t
V
R
= 0 V
F = 1 MHz
pF
MAXIMUM
REVERSE
RECOVERY TIME
trr
I
F
=
I
R
= 200 mA
i
rr
= 20 mA
R
L
= 100 ohms
ns
5770A
5770A
1
0.1
8.0
40
20
NOTE 1:
Pulsed: P
W
= 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.
Copyright
©
2007
3-27-2007
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

5768A Related Products

5768A 5770A
Description Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1941  2010  2232  2144  912  40  41  45  44  19 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号