| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | SOT-23 |
| package instruction | TSSOP, TO-236 |
| Contacts | 3 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| Other features | ORGANIZED AS 6 PAGES OF 32 BYTES EACH |
| Maximum clock frequency (fCLK) | 0.01667 MHz |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G3 |
| JESD-609 code | e4 |
| length | 2.92 mm |
| memory density | 1536 bi |
| Memory IC Type | OTP ROM |
| memory width | 1 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 3 |
| word count | 1536 words |
| character code | 1500 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| organize | 1.5KX1 |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TO-236 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.22 mm |
| Maximum slew rate | 0.00002 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.65 V |
| Nominal supply voltage (Vsup) | 2.7 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.96 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1.3 mm |
| Base Number Matches | 1 |