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SMCJ1.5KE130C-TP-HF

Description
Trans Voltage Suppressor Diode
CategoryDiscrete semiconductor    diode   
File Size314KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

SMCJ1.5KE130C-TP-HF Overview

Trans Voltage Suppressor Diode

SMCJ1.5KE130C-TP-HF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Reach Compliance Codecompli
ECCN codeEAR99
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
Humidity sensitivity level1
Peak Reflow Temperature (Celsius)260
Maximum time at peak reflow temperature10
Base Number Matches1
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla Street Chatsworth

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SMCJ1.5KE6.8(C)A
THRU
SMCJ1.5KE550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
1500 Watt
DO-214AB
(SMCJ) (LEAD
FRAME)
G
Features
For surface mount applicationsin in or der to optimize
board space
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Low profile package
Fast response time: typical less than 1.0ps from 0 volts to
V
BR
minimum
Halogen
free available upon request by adding suffix "-HF"
Low inductance
Excellent clamping capability
UL Recognized File # E331408
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotesposit ive end (cathode)
except Bidirectional
Maximum soldering temperature: 260 C for 10 seconds
o
H
D
A
C
Maximum Ratings @ 25 C Unless Otherwise Specified
Peak Pulse Current on
I
PP
See Table 1 Note:
2
10/1000us waveform
Peak Pulse Power
P
PP
1500W Note:
2
3
Dissipation
Operation And Storage T
J
, T
STG
-55
o
C to
Temperature Range
+175
o
C
Typical Thermal
R
thJL
15
o
C/W
Resistance Junction
to Lead
Typical Thermal
R
thJA
75
O
C/W
Resistance Junction
to Ambient
o
E
B
F
DIMENSIONS
INCHES
MIN
.079
.108
.002
.006
.030
..305
.260
.220
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
DIM
A
B
C
D
E
F
G
H
MAX
.103
.128
.008
.012
.050
.320
.280
.245
MAX
2.62
3.25
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190
0.125”
NOTES:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
0.070”
2.
3.
Non-repetitive current pulse, per Fig.3 and derated above
o
T
A
=25 C per Fig.2.
2
Mounted on 8.0mm copper pads to each terminal.
www.mccsemi.com
Revision:
E
1 of 5
2013/07/18
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