IC 1K X 8 OTPROM, CDIP24, 1.280 X 0.310 X 0.200 INCH, DIP-24, Programmable ROM
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| length | 31.9405 mm |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX8 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8670601LX | 5962-8670602LX | |
|---|---|---|
| Description | IC 1K X 8 OTPROM, CDIP24, 1.280 X 0.310 X 0.200 INCH, DIP-24, Programmable ROM | IC 1K X 8 OTPROM, CDIP24, 1.280 X 0.310 X 0.200 INCH, DIP-24, Programmable ROM |
| Maker | NXP | NXP |
| Parts packaging code | DIP | DIP |
| package instruction | DIP, | DIP, |
| Contacts | 24 | 24 |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| JESD-30 code | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 |
| length | 31.9405 mm | 31.9405 mm |
| memory density | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM |
| memory width | 8 | 8 |
| Number of functions | 1 | 1 |
| Number of terminals | 24 | 24 |
| word count | 1024 words | 1024 words |
| character code | 1000 | 1000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| organize | 1KX8 | 1KX8 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 |
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