*Customer:
SPECIFICATION
ITEM
MODEL
REVISION DATE
FLASH LED DEVICE
FCW201Z
Rev0.4(070727)
[
Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Soldering profile
5. Outline dimension
6.
Precaution for use
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
FCW201Z
Seoul Semiconductor
- 1/7 -
1. Features
Package : 2.3
×
1.9
×
0.75 mm
Color coordinates: according to CIE 1931
Tape and reel packing
2. Absolute Maximum Ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM*1
V
R
T
opr
T
stg
Value
960
300
1000
5
-30 ~ 80
-40 ~ 100
(Ta=25℃)
Unit
½
㎃
㎃
V
℃
℃
*1 I
FM
conditions: Pulse width Tw≤ 300ms, Duty ratio≤ 1/10
3. Electro-Optical Characteristics
Characteristics
Forward Voltage
Reverse Current
Symbol
V
F
I
R
Condition
I
F
=300㎃
V
R
=5V
I
F
=300㎃
Luminous Intensity
*2
I
V
I
F
=400㎃
(Flash mode)
*3
I
F
=1000㎃
(Peak current mode)
*4
I
F
=400㎃
(Flash mode)
*3
I
F
=300㎃
I
F
=300㎃
I
F
=300㎃
I
F
=300㎃
-
-
-
Min
-
-
-
-
-
Typ
3.2
-
20
25
45
53
25
53
0.31
0.32
120
(Ta=25℃)
Max
-
50
-
-
-
lx@0.7m
lx@1m
lm
Unit
V
㎂
cd
Illumination
Luminous Flux
Chromaticity Coordinates
Viewing Angle
lx
lm
X
Y
-
-
-
˚
Δ
1/2
θ
*2 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3 Flash mode condition is Pulse width Tw = 2sec, Duty ratio = 2 / 7
*4 Peak current mode is Pulse width Tw≤ 300ms, Duty ratio≤ 1/10
[Note] ( Tolerance : IV±10%, color coordinate
±0.01,
V
F
±0.1
)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
FCW201Z
- 2/7 -
Forward Current vs. Forward Voltage
Luminous Intensity vs. Forward Current
1000
C u rr e n t [ m A ]
L u m i n o s it y
R e l a ti v e
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
100
[a . u . ]
10
1
3
2
F o r w a r d
1
0
0
200
F o r w a r d
V o lt a g e [ V ]
F o r w a r d
400
C u rr e n t [ m A ]
600
800
1000
Forward Current Derate Curve
400
350
300
250
200
150
100
50
0
-25
0.285
0.310
Forward Current vs Chromaticity Coordinate
x
y
Forward current I
F
(mA)
C o o r d i n a t e
C h r o m a tis it y
0
25
50
o
0.305
0.300
0.295
0.290
75
100
200
F o r w a r
400
C u r r e n t
600
m A ]
d
[
800
1000
Ambient temperature Ta( C)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
FCW201Z
- 3/7 -
(Ta=25℃)
Radiation Diagram
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
120
130
140
150
160
170
180
110
100
90
80
70
60
50
40
30
20
10
0
Y
Y
Spectrum
1.0
Ta = 25 C
o
0.8
Intensity [a.u.]
0.6
0.4
0.2
0.0
400
450
500
550
600
650
700
750
Wavelength [nm]
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
FCW201Z
- 4/7 -
4. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
LED Surface temperature
°C
Operation heating
240
150
~
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
°C
Operation heating
260
150
~
120
0
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
60 to 120 sec.
5 to 10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
FCW201Z
- 5/7 -
京公网安备 11010802033920号
EEWORLD
