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MZA1608

Description
Chip Beads(SMD Array) For General Signal Line
File Size46KB,2 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
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MZA1608 Overview

Chip Beads(SMD Array) For General Signal Line

(1/2)
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA1608 Type
FEATURES
• A single MZA series chip provides noise attenuation for four
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
APPLICATIONS
High-frequency noise countermeasure in computers, printers,
VCRs, televisions, portable telephones, and other equipment.
PRODUCT IDENTIFICATION
MZA 1608 S 121 C T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
1.6±0.1
Ferrite
0.8±0.1
0.15
0.5
0.4
0.2
Dimensions in mm
Terminal
electrode
1.1 to 1.4
0.4
0.5±0.1
0.2
CIRCUIT DIAGRAM
• No polarity
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
5000 pieces/reel
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-01 / 20070723 / e9421_mza1608.fm

MZA1608 Related Products

MZA1608 MZA1608S121CT MZA1608S121C MZA1608S800C MZA1608S241C
Description Chip Beads(SMD Array) For General Signal Line Chip Beads(SMD Array) For General Signal Line Chip Beads(SMD Array) For General Signal Line Chip Beads(SMD Array) For General Signal Line Chip Beads(SMD Array) For General Signal Line

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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