V
DSM
I
TAVM
I
TRMS
I
TSM
V
T0
r
T
=
=
=
=
=
=
4200 V
1150 A
1800 A
15000 A
0.95 V
0.575 mΩ
Ω
Phase Control Thyristor
5STP 12F4200
Doc. No. 5SYA1021-03 Jan. 02
•
•
•
•
Patented free-floating silicon technology
Low on-state and switching losses
Designed for traction, energy and industrial applications
Optimum power handling capability
Blocking
Maximum rated values
1)
Symbol
V
DRM,
V
RRM
V
RSM
dV/dt
crit
Parameter
Conditions
f = 50 Hz, t
p
= 10 ms
t
p
= 5 ms, single pulse
Exp. to 0.67 x V
DRM
, T
vj
= 125°C
5STP 12F4200
4200 V
4600 V
5STP 12F4000
4000 V
4400 V
1000 V/µs
min
typ
5STP 12F3600
3600 V
4000 V
Characteristic values
Symbol Conditions
I
DRM
I
RRM
V
DRM
, T
vj
= 125°C
V
RRM
, T
vj
= 125°C
max
200
200
Unit
mA
mA
Forward leakage current
Reverse leakage current
Mechanical data
Maximum rated values
1)
Parameter
Mounting force
Acceleration
Acceleration
Characteristic values
Symbol Conditions
F
M
a
a
Device unclamped
Device clamped
min
14
typ
22
max
24
50
100
Unit
kN
m/s
m/s
Unit
kg
mm
mm
2
2
Parameter
Weight
Surface creepage distance
Air strike distance
Symbol Conditions
m
D
S
D
a
min
25
14
typ
0.6
max
1)
Maximum ratings are those values beyond which damage to the device may occur
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
5STP 12F4200
On-state
Maximum rated values
1)
Parameter
Average on-state current
RMS on-state current
Peak non-repetitive surge
current
Limiting load integral
Peak non-repetitive surge
current
Limiting load integral
Characteristic values
Symbol Conditions
I
TAVM
I
TRMS
I
TSM
It
I
TSM
It
2
2
min
typ
max
1150
1800
15000
1125
16000
1062
Unit
A
A
A
kA
2
s
A
kA
2
s
Unit
V
V
mΩ
mA
mA
mA
mA
Half sine wave, T
c
= 70°C
tp = 10 ms, T
vj
= 125°C,
V
D
= V
R
= 0 V
tp = 8.3 ms, T
vj
= 125°C,
V
D
= V
R
=0 V
min
typ
Parameter
On-state voltage
Threshold voltage
Slope resistance
Holding current
Latching current
Symbol Conditions
V
T
V
T0
r
T
I
H
I
L
T
vj
= 25°C
T
vj
= 125°C
T
vj
= 25°C
T
vj
= 125°C
I
T
= 2000 A, T
vj
= 125°C
I
T
= 600 A - 1800 A, T
vj
= 125°C
max
2.1
0.95
0.575
80
60
500
200
Switching
Maximum rated values
1)
Parameter
Critical rate of rise of on-
state current
Critical rate of rise of on-
state current
Symbol Conditions
di/dt
crit
di/dt
crit
Cont.
T
vj
= 125°C, I
TRM
= 2000 A, f = 50 Hz
V
D
≤
0.67⋅V
DRM
,
Cont.
I
FG
= 2 A, t
r
= 0.5 µs
f = 1Hz
T
vj
= 125°C, I
TRM
= 2000 A,
V
R
= 200 V, di
T
/dt = -5 A/µs,
V
D
≤
0.67⋅V
DRM
, dv
D
/dt = 20 V/µs,
min
typ
max
100
1000
Unit
A/µs
A/µs
µs
Circuit-commutated turn-off t
q
time
Characteristic values
600
Parameter
Recovery charge
Delay time
Symbol Conditions
Q
rr
t
d
T
vj
= 125°C, I
TRM
= 2000 A,
V
R
= 200 V, di
T
/dt = -5 A/µs
V
D
= 0.4⋅V
DRM
, I
FG
= 2 A, t
r
= 0.5 µs
min
2500
typ
max
4000
2
Unit
µAs
µs
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1021-03 Jan. 02
page 2 of 6
5STP 12F4200
Triggering
Maximum rated values
1)
Parameter
Peak forward gate voltage
Peak forward gate current
Peak reverse gate voltage
Gate power loss
Average gate power loss
Characteristic values
Symbol Conditions
V
FGM
I
FGM
V
RGM
P
G
P
GAV
Symbol Conditions
V
GT
I
GT
V
GD
I
GD
T
vj
= 25°C
T
vj
= 25°C
V
D
= 0.4 x V
DRM
, T
vjmax
= 125°C
V
D
= 0.4 x V
DRM
, T
vjmax
= 125°C
For DC gate current
min
typ
max
12
10
10
3
Unit
V
A
V
W
see Fig. 9
min
typ
max
2.6
400
0.3
10
Unit
V
mA
V
mA
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Gate non-trigger current
Thermal
Maximum rated values
1)
Parameter
Operating junction
temperature range
Characteristic values
Symbol Conditions
T
vj
min
typ
max
125
Unit
°C
°C
Unit
K/kW
K/kW
K/kW
K/kW
K/kW
Storage temperature range T
stg
Parameter
Symbol Conditions
Double-side cooled
Anode-side cooled
Cathode-side cooled
Double-side cooled
Single-side cooled
-40
min
typ
140
max
17
33
35
4
8
Thermal resistance junction R
th(j-c)
to case
R
th(j-c)A
R
th(j-c)C
Thermal resistance case to R
th(c-h)
heatsink
R
th(c-h)
Analytical function for transient thermal
impedance:
Z
thJC
(t) =
å
R
i
(1 - e
i
=
1
i
R
i
(K/kW)
τ
i
(s)
1
10.35
0.3723
2
3.76
0.0525
3
2.29
n
- t/
τ
i
)
4
0.67
0.0023
Fig. 1
Transient thermal impedance junction-to case.
0.0057
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1021-03 Jan. 02
page 3 of 6
5STP 12F4200
Fig. 2
On-state characteristics.
Fig. 3
On-state characteristics.
T
j
=125°C, 10ms half sine
Fig. 4
On-state power dissipation vs. mean on-state
current. Turn - on losses excluded.
Fig. 5
Max. permissible case temperature vs. mean
on-state current.
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1021-03 Jan. 02
page 4 of 6
5STP 12F4200
Fig. 6
Surge on-state current vs. pulse length. Half-
sine wave.
I
G
(t)
100 %
90 %
I
GM
I
GM
I
Gon
di
G
/dt
t
r
t
p
(I
GM
)
≈
2..5 A
≥
1.5 I
GT
≥
2 A/µs
≤
1
µs
≈
5...20
µs
Fig. 7
Surge on-state current vs. number of pulses.
Half-sine wave, 10 ms, 50Hz.
di
G
/dt
10 %
t
r
t
p
(I
GM
)
t
p
(I
Gon
)
t
I
Gon
Fig. 8
Recommended gate current waveform.
Fig. 9
Max. peak gate power loss.
Fig. 10
Recovery charge vs. decay rate of on-state
current.
Fig. 11
Peak reverse recovery current vs. decay rate
of on-state current.
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1021-03 Jan. 02
page 5 of 6
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