Microwave Ceramics and Modules
3-Pole Filter for WLL Base Station TX Filter
Data Sheet
Filter
B69843N3457A120
Application
RF filter for WLL (Wireless Local Loop)
Features
SMD filter consisting of coupled resonators with stepped impedances
MgTiO3-CaTiO3 (εr = 21 /
TCf
=0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
Excellent reflow solderability, no migration effect due to copper/tin metallization
ESD insensitivity and ESD protecting due to filter characteristics
Index
Page 2
Component drawing
Footprint
Page 3
Characteristics
Maximum ratings
Typical passband characteristic
Page 4
Processing information
Soldering requirements
Delivery mode
ISSUE DATE
05.07.04
ISSUE
P1
PUBLISHER
SAW MWC PD
PAGE
1/4
Microwave Ceramics and Modules
3-Pole Filter for WLL Base Station TX Filter
Data Sheet
Filter
B69843N3457A120
Component drawing
View from below onto the solder terminals and view from beside
Recommended Footprint
solder pads
ground area below solder resist with vias
to second ground layer
connected to lines with an impedance of
50 Ohm
FR4 material
permitivity : 4.4
preferred thickness : 0.3
Vias: Ø0.3mm / mm²
For other thickness
correlation might be necessary
ISSUE DATE
05.07.04
ISSUE
P1
PUBLISHER
SAW MWC PD
PAGE
2/4
Microwave Ceramics and Modules
3-Pole Filter for WLL Base Station TX Filter
Data Sheet
Characteristics
min.
Center frequency
Insertion loss
Passband
Amplitude ripple (peak - peak) at any 10MHz BW
Standing wave ratio
Impedance
Power
Attenuation
at 2944 to 3044 MHz
at 3800 to 4200 MHz
Maximum ratings
IEC climatic category (IEC 68-1)
Operating temperature
- 40/+ 90/56
T
op -40 / + 85
f
c -
α
IL
B
120
∆α
SWR
Z
P
α
45
20
51
29
1.5
50
typ.
Filter
B69843N3457A120
max.
-
2.0
MHz
dB
MHz
0.4
2.0
Ω
1.0
W
dB
dB
dB
3450.0
1.6
°C
Typical passband characteristic
2500
0
-10
attenuation [dB]
-20
-30
-40
-50
-60
2700
2900
3100
3300
3500
3700
3900
4100
4300
4500
S11
S21
frequency [MHz]
ISSUE DATE
05.07.04
ISSUE
P1
PUBLISHER
SAW MWC PD
PAGE
3/4
Microwave Ceramics and Modules
3-Pole Filter for WLL Base Station TX Filter
Data Sheet
Processing information
Wettability to IEC 68-2-58:
≥
75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Soldering type
reflow
Maximum soldering temperature
235 (max. 2 sec.)
(measuring point on top surface of the component) 225 (max. 10 sec.)
Recommended soldering conditions (infrared):
Temp. [°C]
within 10 sec.
Filter
B69843N3457A120
Profile for leadfree
solder paste
reflow
260 (max. 2 sec.) °C
250 (max. 10 sec.) °C
Temp. [°C]
within 10 sec.
215°C±10°C
245°C±5°C
20-40 sec.
40-80 sec.
Time [sec.]
30 sec.
2.5 °C/s
2-3 min.
Time [sec.]
> - 5 °C/s
Delivery mode
Blister tape acc. to IEC 286-3, PS, grey
Pieces/tape: 2000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
ISSUE DATE
05.07.04
ISSUE
P1
PUBLISHER
SAW MWC PD
PAGE
4/4
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