, the temperature of the underside of the filter where it makes contact with the circuit board.
2. Specifications are guaranteed over the given temperature range. Operation in excess of any one of these conditions may result in permanent damage to
the device.
Unit
°C
°C
Value
-30 to +85
-30 to +100
2
Typical Performance (25
o
C, Zo = 50 Ohms)
0
-10
d B(S (2,1))
0
-1
d B(S (2,1))
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
-2
-3
-4
-20
-30
-40
-50
1.70
-5 1.83
1.84
1.85
1.86
1.87
1.88
1.89
1.90
1.91
1.92
1.93
Figure 1. Attenuation [dB] vs. Frequency
Figure 2. Insertion Loss [dB] vs. Frequency
0
0
-5
-10
d B(S (2,1))
d B(S (1,1))
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
-10
-15
-20
-25
-30
1.70
-20
-30
-40
-50
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
Figure 3. Attenuation [dB] vs. Frequency (broadband)
Figure 4. Return Loss [dB] vs. Frequency
S (1,1)
fre q (1.700GHz to 2.100GHz)
Figure 5. Typical S(1,1)
S (2,2)
fre q (1.700GHz to 2.100GHz)
Figure 6. Typical S(2,2)
3
PCB Interface & Mounting instructions
Mounting Consideration and board description
The ACPF- 7002 FBAR filter has one input (Pin 1),
one output (Pin 3) and two grounds (Pins 2, 4).
• Demo board uses 3 mil Getek Microstrip.
The demoboard uses CPWG transmission lines for
high isolation between the two ports. It uses via
holes to connect the CPWG line from the
underside of the board to the filter mounting pads
on top.
Note:
For best performance, try to reproduce this board stack up
closely. If Ground-Signal-Ground (GSG) type board is used,
better return loss can be achieved since it eliminates
connector mismatch.
Demo boards
Demo boards are available.
(See board drawing in Figure 7, 8, 9).
Layer1 (signal)
Input connection
TOP
BACK
Output connection
Figure 8. PCB Footprint pad
0.7 mils
Getek
Getek ML200D (
T
=3.9)
3 mils
0.7 mils
Getek
Getek ML200D (
T
=4.2)
28 mils
Layer 2 (ground)
Figure 9. Closer look at the recommended board footprint and soldermask
Layer 3 (signal)
Getek
Getek material ML200D and RG200D
Figure 7. Board stack up description
4
0.60
±
0.15
0.60
±
0.15
1.25 MAX
0.35
±
0.15
8X
SIDE VIEW
Shaded Region Grounded
: Pin 1 Location
A
: Work Week
B,C,D : Lot Number
2
1
1.6
4
3
2.0
B
Pin 1
Marking
A
C
D
Note:
Dimensions in mm
Figure 10. Detailed Bottom, Side and Top view of Package
Layer 1
0.61
0.70
0.61
0.30
Layer 2 (GROUND layer)
0.3
0.55
0.05
4
OUT
3
0.30
0.05
IN
1
0.33
Metal voided
To decrease
Capacitance at
Input Port
0.3
1.5
0.31
2
1.92
0.3
Metal voided
To decrease
Capacitance at
output Port
Via to layer 2
This region is Soldermask covering ground
Region (4) & (2) is exposed ground for soldering filter pads
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