PDI-C172SMF
Photodiode in Plastic Surface Mount Package
PACKAGE DIMENSIONS INCH [mm]
PACKAGE DIMENSIONS INCH [mm]
.158 [4.00]
.079 [2.00]
CATHODE
.043 [1.10]
.019 [0.48]
CATHODE MARK
2X .020 [0.51]
.085 [2.15]
.197 [5.00]
130°
VIEWING
ANGLE
.173 [4.40]
.158 [4.00]
ANODE
.012 [0.30]
2X .047 [1.19]
.142 [3.61]
CHIP DIMENSIONS INCH [mm]
CHIP DIMENSIONS INCH [mm]
.118 [3.00] SQUARE
2X .158 [4.00]
.109 [2.77] SQUARE
ACTIVE AREA
SURFACE MOUNT PACKAGE
SUGGESTED PAD LAYOUT
FOR REFLOW SOLDERING
SURFACE MOUNT PACKAGE
FEATURES
•
•
•
•
Surface mount
Photoconductive
Low cost
High speed
DESCRIPTION
The
PDI-C172SMF
is a blue enhanced PIN silicon
photodiode ideal for high speed photoconductive or
photovoltaic applications packaged in a black plastic
surface mount package.
APPLICATIONS
•
•
•
•
Photointerrupters
Oximeter sensors
Barcode
Glucometers
ABSOLUTE MAXIMUM RATING
(TA)= 23°C UNLESS OTHERWISE NOTED
SYMBOL
V
BR
T
STG
T
O
T
S
PARAMETER
Reverse Voltage
Storage Temperature
Operating Temperature
Soldering Temperature*
-55
-40
MIN
MAX
60
+100
+80
+260
UNITS
Responsivity (A/W)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
250
350
SPECTRAL RESPONSE
V
°C
°C
°C
* 1/16 inch from case for 3 seconds max.
450
550
650
750
850
950
1050
1150
Wavelength (nM)
ELECTRO-OPTICAL CHARACTERISTICS RATING
(TA)= 23°C UNLESS OTHERWISE NOTED
SYMBOL
I
SC
I
D
R
SH
C
J
lrange
V
BR
NEP
t
r
CHARACTERISTIC
Short Circuit Current
Dark Current
Shunt Resistance
Junction Capacitance
Spectral Application Range
Breakdown Voltage
Noise Equivalent Power
Response Time
TEST CONDITIONS
H = 100 fc, 2850 K
V
R
= 10 V
V
R
= 10 mV
V
R
= 10 V,
f
= 1 MHz
Spot Scan
I = 10
μA
V
R
= 10V @
l=Peak
RL = 1KΩ,V
R
= 10 V
MIN
TYP
90
4
400
15
840
60
4x10
-14
20
MAX
30
UNITS
μA
nA
MW
pF
nm
V
W/
√
Hz
nS
1050
**Response time of 10% to 90% is specified at 660nm wavelength light.
Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are
subject to change without notice.
www.lasercomponents.com
Issue:
08/06
/ V1 / HW /
api/si-pin/plastic-encap-sm/ pdi-c172smf.pdf
Germany and other countries: LASER COMPONENTS GmbH, Phone: +49 8142 2864 0, Fax: +49 8142 2864 11, info@lasercomponents.com
Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk
stm32/stm8
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