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PM100RLA060_05

Description
FLAT-BASE TYPE INSULATED PACKAGE
File Size134KB,9 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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PM100RLA060_05 Overview

FLAT-BASE TYPE INSULATED PACKAGE

MITSUBISHI <INTELLIGENT POWER MODULES>
PM100RLA060
FLAT-BASE TYPE
INSULATED PACKAGE
PM100RLA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1µm fine rule process.
For example, typical V
ce
(sat)=1.5V @Tj=125°C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
c) New small package
Reduce the package size by 10%, thickness by 22% from
S-DASH series.
d) Current rating of brake part increased.
50% for the current rating of inverter part.
• 3φ 100A, 600V Current-sense IGBT type inverter
• 50A, 600V Current-sense regenerative brake IGBT
• Monolithic gate drive & protection logic
• Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
• Acoustic noise-less 11kW class inverter application
• UL Recognized
Yellow Card No.E80276(N)
File No.E80271
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
11
7
19.75
19.75
3.25
16
3-2
16
3-2
120
106
16
3-2
15.25
6-2
2-φ5.5
MOUNTING HOLES
Dimensions in mm
16
3
12
17.5
1
P
5
9
13
19
14.5
B
U
V
W
32
6-M5 NUTS
10.75
(SCREWING DEPTH)
11.75
13.5
55
2-φ2.5
17.5
N
12
32.75
23
23
23
22
+ 1
– 0.5
Terminal code
19-s0.5
7
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
VUPC
UFO
UP
VUP1
VVPC
VFO
VP
VVP1
VWPC
WFO
11.
12.
13.
14.
15.
16.
17.
18.
19.
WP
VWP1
VNC
VN1
Br
UN
VN
WN
Fo
13
31
12
May 2005

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