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528-AG138D

Description
IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder
Categorysocket   
File Size129KB,2 Pages
ManufacturerThomas & Betts Corporation
Websitehttp://www.tnb.com/
Download Datasheet Parametric View All

528-AG138D Overview

IC Socket, DIP28, 28 Contact(s), 2.54mm Term Pitch, 0.6inch Row Spacing, Solder

528-AG138D Parametric

Parameter NameAttribute value
MakerThomas & Betts Corporation
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresSHOCK AND VIBRATION RESISTANT
body width0.7 inch
subject depth0.18 inch
body length1.4 inch
Contact to complete cooperationSN-PB
Contact completed and terminatedTIN OVER NICKEL
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP28
Dielectric withstand voltage1000VAC V
Shell materialTHERMOPLASTIC
Insulation resistance5000000000 Ω
Manufacturer's serial number500
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts28
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.6 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
500 Series
A
DIP Socket with Four-Fingered Contact & Solid Insulator
Wide tapered entry
Low profile
“X” & “Y”
stackable
insulator
Precision
four-finger
inner contact
Non-wicking
closed bottom
528-AG11D-ES
Solderless wrap
or PC termination
FEATURES:
The Augat 500 Series Socket features a precision four-finger inner contact
to produce the industry standard for high reliability screw machine sockets.
• Precision four-finger inner contact provides concentric funnel entry for
easy flat and round lead insertion
• Machined (Premium Series) and stamped (Economy Series) contacts
are available
• "X" & "Y" stackable
• Non-wicking, closed bottom sleeve gives 100% protection against flux
and solder contamination. Choice of solderless wrap or PC termination
• Accommodates 6 through 40 pin DIPS, rectangular or round leads
Recognized under the Component Program of Underwriters
Laboratories, Inc. file no. E111362
®
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 125 Grams (4.4 oz.) average with .018" (0,46) dia.
polished steel pin (Premium Series)
200 Grams (7.1 oz.) average with .018" (0,46) dia.
polished steel pin (Economy Series)
Inner Contact Retention
in Sleeve ...................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic ..................... 3.0 Lbs. per line minimum
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. Premium - 134 Grams (4.7 oz.) average with a
.018" (0,46) dia. polished steel pin
Economy - 179 Grams (6.3 oz.) average with a
.018" (0,46) dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
(Premium and Economy) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
• Beryllium copper inner contact for maximum mechanical and
electrical performance
• For extreme conditions involving shock and vibration, Augat's high
retention series is available
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• PCB Hole Size Range:
.035"
±
.002" (0,89
±
0,05) PC tail,
.055"
±
.003" (1,40
±
0,08) solderless wrap
• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
.011" x .020" (0,28 x 0,51)
.016" to .021" (0,41 to 0,53) round lead,
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Sleeve ............................ Machined brass/formed copper
Contact .......................... Beryllium copper
Sleeve Plating ................ Tin/lead or gold
Contact Plating .............. Premium or Economy Series (ES) - gold or
tin/lead
Economy Series (ESL) - low gold
Vapor Phase/IR Compatible
Quality & Innovation From The
Product Group
A10
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
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