MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS11033
PS11033
FLAT-BASE TYPE
FLAT-BASE TYPE
INSULATED TYPE
INSULATED TYPE
PS11033
INTEGRATED FUNCTIONS AND FEATURES
• Converter bridge for 3 phase AC-to-DC power conversion.
• 3 phase IGBT inverter bridge configured by the latest 3rd.
generation IGBT and diode technology.
• Inverter output current capability I
O
(Note 1):
Type Name Motor Rating I
O
(100%) I
O
(150%; 60sec)
4.5Arms
PS11033 0.4 kW/200V AC 3.0Arms
(Note 1) : The inverter output current is assumed to be sinu-
soidal and the peak current value of each of the
above loading cases is defined as : I
OP
= I
O
× √
2,
T
C
< 100°C
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS:
• P-Side IGBTs : Drive circuit, high-level-shift circuit, bootstrap circuit supply scheme for Single Control-Power-Source drive, and un-
der voltage (UV) protection.
• N-Side IGBTs : Drive circuit, DC-Link current sense and amplifier circuits for overcurrent protection, control-supply under-voltage
protection (UV), and fault output (F
O
) signaling circuit.
• Fault Output : N-side IGBT short circuit (SC), over-current (OC), and control supply under-voltage (UV).
• Inverter Analog Current Sense : N-Side IGBT DC-Link Current Sense.
• Input Interface : 5V CMOS/TTL compatible, Schmitt Trigger input, and Arm-Shoot-Through interlock protective function.
APPLICATION
Acoustic noise-less 0.4kW/200V AC Class 3 phase inverters, motor control applications, and
motors with built-in small size inverter package
PACKAGE OUTLINES
74
±1
60
36
0.4
16.5
±0.5
Terminals Assignment :
1. CBU+
2. CBU–
3. CBV+
4. CBV–
5. CBW+
6. CBW–
7. VD
8. UP
9. VP
10. WP
11. UN
12. VN
13. WN
14. FO
15. Vamp
16. GND
21. P1
22. R
23. S
24. T
25. N1
26. P2
27. U
28. V
29. W
30. N2
4
12
34
56
7 8 9 10 12 14 16
11 13 15
4
63
±1
2-R
2.2
50.7
±0.8
5
4.5
(25.7)
2
0.6
3
±0.5
25
15
2-R
1.2
5.08
21 22 23 24 25 26 27 28 29
30
25
±0.5
4.5
4
40
0.6
9
45.72
(69)
2
3.5
4-R3
8.5
±0.5
55.5
2
16.5
±0.5
Type name,LotNo.
(Fig. 1)
Jan. 2000
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS11033
FLAT-BASE TYPE
INSULATED TYPE
INTERNAL FUNCTIONS BLOCK DIAGRAM
P1
R
S
T
N1
UV Protection
P2
Input signal conditioning
(Interlock circuit)
VD
UP
VP
WP
UN
VN
WN
FO
V(amp)
Level shifter
Drive circuit
U
V
W
OC/SC Protection
+–
UV Protection
Drive circuit
Fo Circuit
GND
N2
(Fig. 2)
MAXIMUM RATINGS
(Tj = 25°C)
INVERTER PART
Symbol
V
CC
Item
Supply voltage
Condition
Applied between P2-N2
Ratings
450
500
600
600
±8 (±16)
Unit
V
V
V
V
A
V
CC(surge)
Supply voltage (surge)
Applied between P2-N2, Surge-value
V
P
or V
N
Each output IGBT collector-emitter static voltage Applied between P2-U.V.W, U.V.W-N2
V
P(S)
or
V
N(S)
±Ic(±Icp)
Each output IGBT collector-emitter
switching voltage
Each output IGBT collector current
Applied between P2-U.V.W, U.V.W-N2
T
C
= 25°C, “(
)” means I
C
peak value
CONVERTER PART
Symbol
V
RRM
Ea
I
O
I
FSM
I
2
t
Item
Repetitive peak reverse voltage
Recommended AC input voltage
DC output current
Surge (non-repetitive) forward current
I
2
t for fusing
3φ rectifying circuit
1 cycle at 60Hz, peak value non-repetitive
Value for one cycle of surge current
Condition
Ratings
800
220
10
100
42
Unit
V
Vrms
A
A
A
2
s
CONTROL PART
Symbol
V
D
, V
DB
V
CIN
V
FO
I
FO
I
amp
Supply voltage
Input signal voltage
Fault output supply voltage
Fault output current
DC-Link IGBT current signal Amp output current
Item
Ratings
–0.5 ~ 20
–0.5 ~ +7.5
–0.5 ~ +7.5
15
1
Unit
V
V
V
mA
mA
Jan. 2000
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS11033
FLAT-BASE TYPE
INSULATED TYPE
TOTAL SYSTEM
Symbol
T
j
T
stg
T
C
V
ISO
—
Item
Junction temperature
Storage temperature
Module case operating temperature
Isolation voltage
Mounting torque
Condition
(Note 2)
—
(Fig. 3)
60 Hz sinusoidal AC applied between all terminals and
the base plate for 1 minute.
Mounting screw: M4
Ratings
–20 ~ +125
–40 ~ +125
–20 ~ +100
2500
0.98 ~ 1.47
Unit
°C
°C
°C
Vrms
N·m
(Note 2) : The indicated values are specified considering the safe operation of all the parts within the ASIPM. The max. ratings for the ASIPM
power chips (IGBT & FWDi) is Tj < 150.
CASE TEMPERATURE MEASUREMENT POINT
T
C
(Fig. 3)
THERMAL RESISTANCE
Symbol
Rth(jc)
Q
Rth(jc)
F
Rth(jc)
FR
Rth(cf)
Junction to case Thermal
Resistance
Contact Thermal Resistance
Item
Inverter IGBT (1/6)
Inverter FWDi (1/6)
Converter Di (1/6)
Case to fin thermal, grease applied (1 Module)
Condition
Ratings
Min.
—
—
—
—
Typ.
—
—
—
—
Max.
4.1
6.1
4.8
0.074
Unit
°C/W
°C/W
°C/W
°C/W
ELECTRICAL CHARACTERISTICS
(Tj = 25°C, V
D
= 15V, V
DB
= 15V unless otherwise noted)
Symbol
V
CE(sat)
V
EC
V
FR
I
RRM
ton
tc(on)
toff
tc(off)
trr
FWDi reverse recovery time
Item
Collector-emitter saturation
voltage
FWDi forward voltage
Condition
Tj = 25°C, Input = ON, Ic = 8A, V
D
= V
DB
= 15V
(Shunt voltage drop not included)
Tj = 25°C, –I
C
= 8A
Ratings
Min.
—
—
—
—
0.3
—
—
—
—
Typ.
—
—
—
—
0.6
0.43
1.6
0.5
0.12
Max.
2.9
2.9
1.5
8
1.5
0.8
2.5
1.2
—
Unit
V
V
V
mA
µs
µs
µs
µs
µs
Tj = 25°C, I
FR
= 5A
Converter diode voltage
Converter diode reverse current V
R
= V
RRM
, Tj = 125°C
1/2 Bridge inductive, Input = 5V
↔
0V
V
CC
= 300V, I
C
= 8A, Tj = 125°C
V
D
= 15V, V
DB
= 15V
Note: ton, toff include delay time of the internal control
circuit.
Switching times
Short circuit endurance
@V
CC
≤
400V, Input = 5V
→
0V (One-Shot)
(Output, Arm, and Load Short Circuit Modes) –20°C
≤
Tj (start)
≤
125°C, 13.5V
≤
V
D
= V
DB
≤
16.5V
Switching SOA
@V
CC
≤
400V, Input = 5V
↔
0V, Tj
≤
125°C
I
C
< OC trip level, 13.5V
≤
V
D
= V
DB
≤
16.5V
• No destruction
• F
O
output by protection operation
• No destruction
• No protecting operation
• No F
O
output
Jan. 2000
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS11033
FLAT-BASE TYPE
INSULATED TYPE
ELECTRICAL CHARACTERISTICS
(Tj = 25°C, V
D
= 15V, V
DB
= 15V unless otherwise noted)
Symbol
I
D
I
DB
V
thon)
V
th(off)
R
i
f
PWM
t
dead
t
int
Vamp(100%)
Vamp(200%)
Vamp(250%)
Vamp(0)
OC
t
OC
SC
t
SC
UV
D
UV
Dr
UV
DB
UV
DBr
tdV
t
FO
I
Fo(H)
I
Fo(L)
Item
Circuit current (Average)
Circuit current (Average)
Input on threshold voltage
Input off threshold voltage
Input pull-up resistor
PWM input frequency
Arm shoot-through blocking time
Input interlock sensing
Inverter DC-Link IGBT current sense voltage
output signal
Inverter DC-Link IGBT current sense voltage
output limit
Over current trip level
Over current delay time
Short circuit trip level
Short circuit delay time
Trip level
Reset level
Supply circuit under
Trip level
voltage protection
Reset level
Delay time
Fault output pulse width
Fault output current
Condition
Tj = 25°C, V
D
= 15V, Vin = 5V
Tj = 25°C, V
D
= V
DB
= 15V, Vin = 5V
Min.
—
—
0.8
2.5
—
1
2.2
—
1.5
3.0
5.0
—
8.5
—
—
—
11.0
11.5
10.1
10.6
—
1.0
—
—
Ratings
Typ.
—
—
1.4
3.0
50
—
—
100
2.0
4.0
—
50
10.6
10
16
2
12.0
12.5
10.8
11.3
10
1.8
—
—
Max.
50
5
2.0
4.0
—
15
—
—
2.5
5.0
—
100
16.0
—
—
—
13.0
13.5
11.6
12.1
—
—
1
15
Unit
mA
mA
V
V
kΩ
kHz
µs
ns
V
V
V
mV
A
µs
A
µs
V
V
V
V
µs
ms
µA
mA
Applied between input terminal-inside power supply
T
C
≤
100°C, Tj
≤
125°C
Relates to corresponding inputs
(Note 3)
T
C
= –20°C ~ +100°C
Relates to corresponding input (Fig. 6)
I
C
= I
OP(100%)
V
D
= 15V
Tj = 25°C (Fig. 4)
I
C
= I
OP(200%)
V
D
= 15V
I
C
= I
OP(250%)
C
= 0A
(Fig. 4)
I
Tj = 25°C
(Fig. 5)
Tj = 25°C
(Fig. 5)
Tj = 25°C
(Fig. 5)
Tj = 25°C
(Fig. 5)
T
C
= Tj = 25°C
(Fig. 5)
Tj = 25°C
Open collector output
(Note 4)
(Note 4)
(Note 3) : The dead-time has to be set externally by the CPU; it is not part of the ASIPM internal functions.
(Note 4) : Fault output signaling is given only when the internal OC, SC, & UV protection circuits are activated.
The OC, SC and UV protection (and fault output) operate for the lower arms only. The OC and SC protection Fault output is given
in a pulse format while that of UV protection is maintained throughout the duration of the under-voltage condition.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
D
V
DB
∆V
D
, V
DB
V
CIN(ON)
V
CIN(OFF)
t
dead
T
C
f
PWM
t
XX
Item
Supply voltage
Supply voltage
Supply voltage
Supply voltage ripple
Input on voltage
Input off voltage
Arm shoot-through blocking time
Module case operating temperature
PWM Input frequency
Allowable minimum input on-pulse width
Condition
Applied across P2-N2 terminals
Applied between V
D
-GND
Applied between CBU+ & CBU–, CBV+ & CBV–, CBW+ & CBW–
Applied between UP • VP • WP • UN • VN • WN and
GND
Relates to corresponding inputs
T
C
≤
100°C, Tj
≤
125°C
Ratings
Min.
—
13.5
13.5
–1
0
4.0
2.2
—
—
1
Vamp
Typ.
300
15.0
15.0
—
—
—
—
—
—
—
Max.
400
16.5
16.5
+1
0.8
5.0
—
100
15
—
Unit
V
V
V
V/µs
V
V
µs
°C
kHz
µs
5
INVERTER DC-LINK IGBT CURRENT ANALOGUE
SIGNALING OUTPUT (TYPICAL)
4
V
D
= 15V
Tj = 25°C
Vamp
(200%)
Vamp (V)
3
2
Vamp
(100%)
1
0
0
(Fig. 4)
200
300
100
Actual Load Peak Current (%), (I
C
= I
O
!
2)
Jan. 2000
MITSUBISHI SEMICONDUCTOR <Application Specific Intelligent Power Module>
PS11033
FLAT-BASE TYPE
INSULATED TYPE
CURRENT ABNORMALITY PROTECTIVE FUNCTIONS
Ic(A)
Short circuit trip level
SC
Over current trip level
OC
Collector current
0
2
10
tw (µs)
Protection is achieved by monitoring and filtering the N-side
DC-Bus current. The over-current protection is activated (after al-
lowing a filtering time of 10
µs)
when the line current reaches
250% of the rated load-current I
O
(rms). Similarly, the short circuit
protection is activated (after allowing a filtering time of 2
µs)
when
the line current reaches twice the rated collector-current (I
C
).
When a current trip-level is exceeded (OC or SC), all the N-side
IGBTs are intercepted (turned OFF) and a fault-signal is output.
After the fault-signal output duration (1.8 ms - typ.), the intercep-
tion is Reset at the following OFF input signal. However, since the
fault may be repetitive, it is recommended to stop the system after
the fault-signal is received and check the fault. The trip-level set-
tings described above are summarized in the following figure:
(Fig. 5)
ARM-SHOOT-THROUGH INTER-LOCK PROTECTIVE FUNCTION
P-Side Input Signal : V
CIN(p)
ON
N-Side Input Signal : V
CIN(n)
ON
a3
P-Side IGBT Gate : V
GE(p)
0
a2
b3
0
a1
a4
b1
b4
b2
N-Side IGBT Gate : V
GE(n)
(Fig. 6)
Description:
(1) During the ON-State of either of the upper-arm or the lower-arm IGBT, the inter-lock protection circuit blocks any erroneous ON pulses (re-
sulting from input noise) from triggering the other arm IGBT and thus it prevents the arm-shoot-through situation.
(2) When two ON-signals are received for both the upper and the lower arms, the signal received first will be passed to the IGBT and the sec-
ond signal will be blocked. The second signal will be passed to its corresponding IGBT immediately after the first signal is OFF.
Note:
This protective function provides no fault signaling output. The Dead-Time has to be set using the micro-controller (CPU).
Operation:
a1. P-side normal ON-signal
⇒
P-side IGBT gate turns ON.
a2. N-side erroneous ON-signal
⇒
N-side IGBT gate remains OFF.
a3. While P-side ON-signal remains
⇒
P-side IGBT gate remains ON.
a4. N-side normal ON-signal
⇒
N-side IGBT gate turns ON.
N-side normal ON-signal
⇒
N-side IGBT gate turns ON.
Simultaneous ON-signals
⇒
P-side IGBT gate remains OFF.
N-side receives OFF-signal
⇒
N-side IGBT gate turns OFF.
Immediately after (b3)
⇒
P-side IGBT gate turns ON.
b1.
b2.
b3.
b4.
RECOMMENDED I/O INTERFACE CIRCUIT
5V
5V
5.1kΩ
R
V
D
(15V)
ASIPM
U
P
,V
P
,W
P
,U
N
,V
N
,W
N
Fo
V(amp)
CPU
R
10kΩ
0.1nF
0.1nF
(Fig. 7)
GND(Logic)
Jan. 2000
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