8RCA064-08M datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > socket> 8RCA064-08M

8RCA064-08M: DescriptionIC Socket, PGA64, 64 Contact(s),; Categorysocket; File Size129KB，1 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

Download Datasheet Parametric View All

8RCA064-08M Overview

IC Socket, PGA64, 64 Contact(s),

8RCA064-08M Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	SOCKET ADAPTER
Contact to complete cooperation	MATTE TIN OVER NICKEL
Contact completed and terminated	Matte Tin (Sn) - with Nickel (Ni) barrier
Contact material	BRASS/COPPER ALLOY
Device slot type	IC SOCKET
Type of equipment used	PGA64
Shell material	GLASS FILLED POLYETHYLENE
JESD-609 code	e3
Number of contacts	64
Base Number Matches	1

Preview

Download Datasheet

View All

Pin Grid Array

Adapters

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

Pin Grid Array Adapters

Standard Quick Turn Terminals

Type -79

Peel-A-Way Only

Type -80

Peel-A-Way Only

.072 Dia.

(1.83)

.072 Dia.

(1.83)

.125

(3.18)

.280

(7.11)

.030

(.76)

.125

(3.18)

.070

(1.78)

.125

(3.18)

.018 Dia.

(.46) Typ. 2

.018 Dia.

(.46) Typ. 2

Features:

• Screw machined terminals.

• Easily customized to fit your application.

Type -81

Peel-A-Way Only

.072 Dia.

(1.83)

.125

(3.18)

.085

(2.16)

.125

(3.18)

.018 Dia.

(.46) Typ. 2

Type -08

.025 Dia.

(.64)

.166

(4.22)

Terminals:

Brass - Copper Alloy (C36000)

ASTM-B-16

.052

(1.32)

.103

(2.62)

.156

(3.96)

.018 Dia.

(.46)

Plating:

Gold over Nickel or

Tin-Lead over Nickel

Gold per MIL-G-45204

Tin-Lead per MIL-P-81728

Nickel per QQ-N-290

Type -68

.018 Dia.

(.46)

.125

(3.18)

.100

(2.54)

Type -43

.018 Dia.

(.46)

.125

(3.18)

Body Material:

HCA

- High Temp. Glass Filled

Thermoplastic (P.P.S.), U.L. Rated 94V-O,

-60˚C to 260˚C (-76˚F to 500˚F)

.210

(5.33)

.335

(8.51)

.100

(2.54)

.125

(3.18)

.018 Dia.

(.46)

.018 Dia.

(.46)

.125

(3.18)

- Polyimide Film, Temperature range

-269˚C to 400˚C (-452˚F to 752˚F)

Type -185

.018 Dia.

(.46)

.125

(3.18)

Type -42

.018 Dia.

(.46)

.125

(3.18)

How To Order

HCA

068

-08

Plating

G - Gold

T - Tin-Lead

.100

(2.54)

.500

(12.70)

.100

(2.54)

.585

(14.86)

Footprint Dash #

If Applicable

Body Type

HCA - High Temp. Molded

KA - Peel-A-Way

.018 Dia.

(.46)

.125

(3.18)

.018 Dia.

(.46)

.125

(3.18)

Terminal Type

Number of Pins

004 - 484 Pins

See pages 37 - 64 for PGA footprints

Quick turn delivery

available on standard terminal types.

Additional terminal types available.

See terminal section for detailed terminal information.

Peel-A-Way

covered by patent rights issued and/or pending.

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 36

Recommended Resources

Interface circuit between 8253 and 8031

Operational amplifier output circuit

vacuum cleaner circuit

remote temperature controller

Tube amplifier TDA1543 DAC circuit diagram

Negative output voltage integrated regulated power supply composed of BG602 Part 2

The micropython official website has started to provide ESP8266 bin files: [font=宋体][size=4] The micropython official website has started to provide ESP8266 bin files. This way you don't have to compile it yourself, it's very convenient, everyone go download and test it! Dow...; michael_llh MicroPython Open Source section

Query and interrupt?: The communication protocol requirements are as follows: Communication content Direction (bidirectional) Length Type Protocol Checksum PC setting PC = Mainboard S' Before each setting protocol, 'S' mus...; sdsongge Embedded System

How To:Lunchpad MSP430 Programing With Linux: 1. Building the MSP430 programming environment under LINUX : This environment can be roughly divided into two main parts: the compilation environment and the writing environment. 1 Compilation environ...; alcz2008 Microcontroller MCU

The data segment is copied from FLASH to SDRAM: 44I don't understand the part in binit.s where the data segment is copied from FLASH to SDRAM. My analysis of that program is as follows: If the storage spaces of the code segment and the data segment...; huihua Embedded System

I would like to ask you experts, what dsp chip should I use if I want to make a binocular camera for face recognition?: [backcolor=rgb(239, 245, 249)]As the title says, I am a dsp newbie. I want to make a binocular camera for face recognition and some other functions. What dsp chip should I use? Is DM642 feasible? How ...; 六安飞雨 DSP and ARM Processors

What are the larger markets for microcontrollers and electronic components in Shanghai?: As the title says, please help me with the statistics....; qxqsz Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components