TECHNICAL DATA
KK74LS07
Hex Non-Inverted Buffers with Open-
Collector Outputs
This device contains hex non inverted buffers with open-collector.
•
High Output Voltage 30 V
•
High Speed t
PD
= 12 ns
•
Low Power Dissipation P
D
= 13 mW per Gate
ORDERING INFORMATION
KK74LS07N
Plastic
KK74LS07D
SOIC
T
A
= 0° to 70° C for all packages
LOGIC DIAGRAM
PIN ASSIGNMENT
Y=A
FUNCTION TABLE
Inputs
A
H
L
PIN 14 =V
CC
PIN 7 = GND
Output
Y
H
L
1
KK74LS07
MAXIMUM RATINGS
*
Symbol
V
CC
V
IN
V
OUT
Tstg
*
Parameter
Supply Voltage
Input Voltage
Output Voltage
Storage Temperature Range
Value
7.0
5.5
30
-65 to +150
Unit
V
V
V
°C
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IH
V
IL
V
OH
I
OL
T
A
Supply Voltage
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Current
Ambient Temperature Range
0
Parameter
Min
4.75
2.0
0.8
30
40
+70
Max
5.25
Unit
V
V
V
V
mA
°C
DC ELECTRICAL CHARACTERISTICS
over full operating conditions
Guaranteed Limit
Symbol
V
IK
I
OH
V
OL
I
IH
I
IL
I
CC
Parameter
Input Clamp Voltage
High Level Output Current
Low Level Output Voltage
High Level Input Current
Low Level Input Current
Supply Current
Test Conditions
V
CC
= 4.75, I
IN
= -18 mA
V
CC
= 4.75, V
OH
= 5.25
V
CC
= 4.75, I
OL
= 16 mA
V
CC
= 4.75, I
OL
= 40 mA
V
CC
= 5.25, V
IN
= 2.7 V
V
CC
= 5.25, V
IN
= 5.5 V
V
CC
= 5.25, V
IN
= 0.4 V
V
CC
= 5.25
Total with
outputs high
Total with
outputs low
Min
Max
-1.5
250
0.4
0.7
20
1
-0.2
14
45
µA
mA
mA
mA
Unit
V
µA
V
2
KK74LS07
R
L
= 100
Ω,t
r
= 15 ns, t
f
= 6.0 ns)
Symbol
t
PLH
t
PHL
AC ELECTRICAL CHARACTERISTICS
(T
A
= 25°C, V
CC
= 5.0 V, C
L
= 15 pF,
Parameter
Propagation Delay, Input A to Output Y
Propagation Delay, Input A to Output Y
Min
Max
10
30
Unit
ns
ns
Figure 1. Switching Waveforms
NOTE A. C
L
includes probe and jig capacitance.
Figure 2. Test Circuit
3
KK74LS07
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
14
8
B
1
7
Dimension, mm
Symbol
A
B
C
MIN
18.67
6.1
MAX
19.69
7.11
5.33
0.36
1.14
2.54
7.62
0°
2.92
7.62
0.2
0.38
10°
3.81
8.26
0.36
0.56
1.78
F
L
D
F
C
-T-
SEATING
N
G
D
0.25 (0.010) M T
K
PLANE
G
H
H
J
M
J
K
L
M
N
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
8
A
14
Symbol
A
MIN
8.55
3.8
1.35
0.33
0.4
1.27
5.27
0°
0.1
0.19
5.8
0.25
MAX
8.75
4
1.75
0.51
1.27
H
B
P
B
C
1
G
7
C
R x 45
D
F
G
-T-
D
0.25 (0.010) M T C M
K
SEATING
PLANE
H
J
F
M
J
K
M
P
R
8°
0.25
0.25
6.2
0.5
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B
‑
0.25 mm (0.010) per side.
4
京公网安备 11010802033920号
EEWORLD
