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3SMBJ5925B

Description
Zener Diode, 10V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMBJ, 2 PIN
Categorydiode   
File Size1004KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

3SMBJ5925B Overview

Zener Diode, 10V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMBJ, 2 PIN

3SMBJ5925B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AA
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
Certification statusNot Qualified
Nominal reference voltage10 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current37.5 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
3SMBJ5913B
THRU
3SMBJ5942B
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMBJ) (LEAD FRAME)
Features
Surface Mount Application
3.3thru
51
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
Available on Tape and Reel
Mechanical Data
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260
0
C for 10 seconds.
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note: 1)
(Note: 2)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
NOTES:
1.
2.
Forward Current @ 200mA.
Mounted on 5.0mm (.013mm thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
www.mccsemi.com
Revision:
3
1 of 4
2007/02/15
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