808-AG11SM datasheet, PDF - EEWORLD Datasheet

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808-AG11SM: DescriptionIC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing; Categorysocket; File Size27KB，2 Pages; ManufacturerThomas & Betts Corporation; Websitehttp://www.tnb.com/

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808-AG11SM Overview

IC Socket, DIP8, 8 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing

808-AG11SM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Thomas & Betts Corporation
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	BUTT STYLE TERMINALS
body width	0.4 inch
subject depth	0.105 inch
body length	0.4 inch
Contact to complete cooperation	AU
Contact material	BE-CU
Contact style	RND PIN-SKT
current rating	3 A
Device slot type	IC SOCKET
Type of equipment used	DIP8
Dielectric withstand voltage	1000VAC V
Shell material	POLYESTER
Insulation resistance	5000000000 Ω
Manufacturer's serial number	800SM
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.3 mm
Terminal pitch	2.54 mm
Base Number Matches	1

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800SM Series

Surface Mount DIP Sockets

814-AG11SM

FEATURES:

Augat offers the precision machined 800SM Series which achieves

compliancy to the board surface and is designed for high temperatures

typical of vapor phase and infrared reflow soldering.

• “Butt” style terminals float in plastic housing for compliancy

to board surface

• Precision four-fingered inner contacts provide concentric funnel entry

for easy flat or round insertion

PERFORMANCE SPECIFICATIONS:

MECHANICAL

Vibration ........................ Passed MIL-STD-1344, Method 2005.1,

Condition II, 10 G's

Shock .............................. Passed MIL-STD-1344, Method 2004.1,

Condition C, 100 G’s

Durability ...................... Passed MIL-STD-1344, Method 2016

Inner Contact

Retention ................ 7.5 Lbs. per line average

Solderability .................. Passed MIL-STD-202F, Method 208

Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)

dia. polished steel pin

Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)

dia. polished steel pin

ELECTRICAL

Contact Resistance ........ 10 Milliohms max.

Contact Rating .............. 3 Amps

Capacitance .................... 1.0 pF per MIL-STD-202, Method 305

(contact to contact)

Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per

MIL-STD-1344, Method 3003.1

Dielectric Withstanding

Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,

Method 3001.1

ENVIRONMENTAL

Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II

Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A

Operation Temperature .. Gold inner contact -55°C to +125°C,

Tin/lead inner contact -55°C to +105°C

APPLICATION DIMENSIONS:

• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)

• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through

.011" x .020" (0,28 x 0,51)

.016" to .021" (0,41 to 0,53) round lead

.105" (2,67) min. length

MATERIAL SPECIFICATIONS:

Insulator ........................ Thermoplastic polyester, UL rated 94V-0

Outer Sleeve .................. Brass

Contacts .......................... Beryllium copper

Sleeve Plating ................ Tin/lead

Contact Plating .............. Gold or tin/lead

Quality & Innovation From The

Product Group

A16

Thomas & Betts

1555 Lynnfield Road

Memphis, TN 38119

(901) 682-8221 FAX (901) 537-8805

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