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BSR18B

Description
PNP General Purpose Amplifier
CategoryDiscrete semiconductor    The transistor   
File Size239KB,4 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Environmental Compliance
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BSR18B Overview

PNP General Purpose Amplifier

BSR18B Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerFairchild
package instructionLEAD FREE PACKAGE-3
Contacts3
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum collector current (IC)0.2 A
Collector-emitter maximum voltage40 V
ConfigurationSINGLE
Minimum DC current gain (hFE)30
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typePNP
Maximum power dissipation(Abs)0.23 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
Maximum off time (toff)300 ns
Maximum opening time (tons)70 ns
PNP General Purpose Amplifier
June 2007
BSR18B
PNP General Purpose Amplifier
This device is designed as a general purpose amplifier and switch.
Sourced from Process 23.
3
Marking
2
1
T93
SOT-23
1. Base 2. Emitter 3. Collector
Absolute Maximum Ratings
Symbol
V
CBO
V
CEO
V
EBO
I
C
T
J,
T
STG
NOTES:
* T
a
= 25°C unless otherwise noted
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Junction Temperature, Storage Temperature
Value
40
40
5.0
200
-55 ~ +150
Units
V
V
V
mA
°C
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
1)
These ratings are based on a maximum junction temperature of 150 degrees C.
2)
These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics
Symbol
P
D
R
θ
JA
Total Device Dissipation
Derate above 25℃
* T
a
= 25°C unless otherwise noted
Characteristic
Max
230
1.84
550
Units
mW
mW/℃
℃/W
Thermal Resistance, Junction to Ambient
*Device mounted on FR-4 PCB 1.6” X 1.6” X 0.06”.
©2007 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
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