ASAHI KASEI
[AK2573A]
AK2573A
125M / 156M
Laser Diode Driver + APC
-
-
-
-
-
-
-
-
Features
1 chip 125M / 156M Laser Diode Driver (LDD) +
Digital APC (APC_FF and APC_FB)
Programmable laser BIAS and modulation current
controlled by an on-chip temperature sensor
(APC_FF)
Digital feedback circuit for APC (APC FB)
Two current output 8 bit DACs,
I-DAC1: 85mA sink for modulation current
I-DAC2: 54mA sink for BIAS current
TXFAULT detection and 1kbit ID Field (EEPROM)
for SFP (Small Form-factor Pluggable) support
I
2
C
TM
compatible digital I/F
Duty adjustment
Power failure alarm (OPTALM), Over current alarm
(CURRALM), Temperature alarm (TEMPALM),
Data alarm (DATAALM) and TXFAULT for failure
alarm
BIAS and modulation current monitors (* 0.0095)
Single 3.3V +/- 0.2V operation
Description
The AK2573A is a 1chip LDD (Laser Diode Driver) and
an APC (Auto Power Control) for laser direct
modulation application. It contains up to 156M LDD,
programmable duty adjustment, BIAS and modulation
currents, a digital feedback circuit, BIAS and
modulation current monitors, failure alarms, I
2
C
TM
interface, an EEPROM for storing LD characteristics
and user information, and TXFAULT detection for SFP
application. The AK2573A has two APC functions;
APC FF (Feed-forward) and APC FB (Feedback). APC
FF supplies a programmed current in response to the
temperature. APC FB provides a stable auto power
control function with an internal digital feedback
algorithm.
All program and operational functions can be set
through the I
2
C
TM
compatible interface and stored in the
on-chip EEPROM.
Ordering Information
Product Number
AK2573AVB
Block Diagram
SEL
DATAP
DATAN
DATA
(LVPECL)
Selecter
DUTY_
ADJ
DRIVER
-
-
Applications
STM-1 / OC-3 (156Mbps) Optical Interface Module
TS–1000 (125Mbps) Optical Interface Module
PKG
BCC++ 48 (7mm * 7mm)
I
2
C
TM
is a trademark o f Philips Corporation.
IMODN
LD
IMOD
Imod
CLKP
CLKN
CLK
(LVPECL)
FF
OSC
I-DAC1
* 0.0095
MODMON
TEMPSENS
ADC
EEPROM
APC
I-DAC2
Ibias
IBIAS
* 0.0095
TEMPMON
BIASMON
DATAALM
OPTALM
ALM
PDGAIN
RPD
CPD
BIAS
RB (12k)
SCL SDA*
WP**
BIAS_GEN
PDIN
CURRALM
TEMPALM
TXFAULT*
Digital I/F
Monitor
PD
PDMON
SHUTDOWN
CONTROL
TXDIS1
TXDIS2
*: Open Drain
**: Pull-up
<MS0189-E-01>
-1-
2004/5
ASAHI KASEI
- Contents -
[AK2573A]
Ⅰ.
Pin Description
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
4
Ⅱ.
Absolute Maximum Rating
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
6
Ⅲ.
Recommend Operation Conditions
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
6
Ⅳ.
Electrical Cghracteristics
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
6
1. Power Consumption
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
6
2. EEPROM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
6
3. Digital Input / Output DC Characteristics
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
7
4. I
2
C
TM
I/F AC Character
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
7
5. LVPECL I/F
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
7
6. I-DAC1
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
8
7. I-DAC2
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
8
8. Duty Cycle Adjustment
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
8
9. Current Monitor
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
8
10. PDGAIN
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
11. DACAPC
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
12. BIASGEN
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
13. Temperature Sensor
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
14. ADC
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
15. Power On Reset
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
16. On-chip Oscillator
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
17. OPTALM Detect Level
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
18. TXDIS Release Time
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
9
Ⅴ.
Package Information
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
10
Ⅵ.
Circuit Description
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
11
1. Parameter Nortation
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
11
1.1 Parameter Definition
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
11
1.2 Operation Overview
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
11
2. Driver
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
12
3. DATA/CLK I/F (LVPECL)
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
12
3.1 LVPECL Input (DATAP/DATAN/CLKP/CLKN)
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
13
3.2 Duty Adjustment
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
14
4. APC
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
14
4.1 APC_FF Function
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
15
4.2 APC_FB Function
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
15
4.2.1 PDGAIN
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
16
4.2.2 DACAPC
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
16
4.2.3 Example of APC Setting
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
16
4.3 Temperature Sensor (TEMPSENS)
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
20
4.4 Current Monitor
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
21
5. Alarm
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
22
5.1 OPTALM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
22
5.2 CURRALM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
22
5.3 TEMPALM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
22
5.4 DATAALM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
22
5.5 TXFAULT
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
22
6. Shutdown
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
23
6.1 Shutdown Operation
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
23
<MS0189-E-01>
-2-
2004/5
ASAHI KASEI
[AK2573A]
6.2 Temperature Compensation between Shutdown Request and Release
½½½½½½½½½½½½½½
23
7. Power-up/down Timing
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
24
7.1 Delay Time of TXFAULT Detection with OPTALM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
24
7.2 Power on Initialization Procedure without Shutdown Request (TXDIS=L)
½½½½½½
25
7.3 Power on Initialization Procedure with Shutdown Request (TXDIS=H)
½½½½½½½½½
25
7.4 TXDIS Timing during Normal Operation
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
26
7.5 TXFAULT Detection / Reset with Recovery
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
26
7.6 TXFAULT Detection / Reset without Recovery
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
27
8. I
2
C
TM
I/F
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
28
8.1 Memory Map
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
28
8.2 Read / Write Operation
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
29
8.2.1 Byte Write
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
29
8.2.2 Page Write
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
29
8.2.3 Current Address Read
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
29
8.2.4 Random Read
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
29
8.2.5 Sequential Read
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
29
8.2.6 Data Change
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
30
8.2.7 Start / Stop Condition
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
30
8.3 EEPROM
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
31
8.4 Register
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
33
9. Operation Mode
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
35
9.1 Self-running Mode
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
35
9.2 Adjustment Mode
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
35
9.3 EEPROM Mode
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
35
9.4 MODE Control
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
35
9.5 Operation Mode Protection
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
35
10. Module Adjustment Example
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
36
Ⅶ.
Circuit Example
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
37
<MS0189-E-01>
-3-
2004/5
ASAHI KASEI
[AK2573A]
Ⅰ.
Pin Description
The symbol of I/O row shows below.
Ai: Analog input, Ai_l: LVPECL input, Ao: Analog output
Di: Digital input, Di_pu: Digital input with pulled-up resistor, Do: Digital output, Dio: Digital input / output,
Do_od: Digital output (open drain), Dio_od: Didital input / output (open drain)
PWR: Power or VSS
PIN#
1
2
3
4
5
6
7
Symbol
NC
DATAP
DATAN
SEL
CLKP
CLKN
WP
Function
No Connection. Connect to the VSS or leave open.
Positive LVPECL data input. Input Inpedance >= 10k
Ω
Negative LVPECL data input. Input Indedance >= 10kΩ
“H” for latched data with clock. “L” for direct data.
Positive LVPECL clock input. Connect to VSS when SEL =“L”.
Negative LVPECL clock input. Connect to VDD or leave open
when SEL = “L”.
Write Protect. Internally pulled-up with 20kΩ (typ).
“H” sets device address 101000 and only user area of EEPROM
can access as read-only. “L” sets device address as 1010 and full
of EEPROM can access as read/write. For more information, see
Table 8-2 and 9-1.
TX Disable.
“H” for disable MOD and BIAS current. TXDIS1 and TXDIS2
are ORed internally. Use 4.7kΩ or more for externally pulled-up
or pulled-down.
Power supply for digital circuit.
TX Fault detection output (Open drain). Connect to VDD with
4.7kΩ to 10kΩ resistor.
Set “H” when detect TEMPALM, CURRALM, OPTALM or
DATAALM.
When set RE_SFP=1 and detect the ALM, TXFAULT is kept
“H” until receiving disable request at TXDIS1 or TXDIS2.
No Connection. Connect to the VSS or leave open.
Serial data input / output (Open drain). Connect to VDD with
4.7k to 10k resistor.
I/O
Ai_l
Ai_l
Di
Ai_l
Ai_l
Di_pu
Remark
Do not
leave open
8
9
10
11
TXDIS1
TXDIS2
DVDD
TXFAULT
Di
Do not
leave open
PWR
Do_od
AC load
≤
100pF
12
13
NC
SDA
Dio_od
14
15
16
17
18
19
SCL
DVSS
NC
DATAALM
OPTALM
CURRALM
Serial clock input. The data (SDA) is shifted in at the rising edge
of SCL and is shifted out at the falling edge of SCL.
VSS for digital circuit.
No Connection. Connect to the VSS or leave open.
Sets the alarm when detects 1’s or 0’s sequential data input. The
detection time is 4.5us (typ).
The polarity can be set with EEPROM.
Sets the alarm when detects monitor PD current drop.
The polarity can be set with EEPROM.
Sets the alarm when detects the over current of I-DAC1 or
I-DAC2.
Alarm level can be set every 6℃.
The polarity can be set with EEPROM.
Di
PWR
Do
Do
Do
AC Load
≤
100pF
Do not
leave open
Do not
leave open
AC Load
≤
30pF
AC Load
≤
30pF
AC Load
≤
30pF
<MS0189-E-01>
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2004/5
ASAHI KASEI
Pin Description (Continued)
PIN# Symbol
Function
20
TEMPALM Sets the alarm when detects the over temperature.
The polarity can be set with EEPROM.
21
TEMPMON Temperature sensor monitor output.
[AK2573A]
I/O
Do
Ao
Remark
AC Load
≤
30pF
AC load
≤
30pF
DC load
≥
50kΩ
22
23
BIAS
PDMON
BIAS reference for internal circuit. Connect to VSS with 12k +/- Ao
1% resistor.
PDIN regulated output. Adjust PDGAIN to PDMON = 1V Ao
(typ).
AC load
≤
30pF
DC load
≥
50kΩ
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
AVSS
AVDD
PDIN
VSSBI
IBIAS
VSSBI
VSSMD
IMOD
IMODN
VSSMD
VDDMD
NC
VDDDR
VSSDR
BIASMON
MODMON
TEST1
TEST2
TEST3
TEST4
TEST5
TEST6
VSS for analog circuit.
Power supply for analog circuit. Connect to the power supply
through R-C LPF (R=10Ω, C=1uF is recommended).
Monitor PD voltage input. Monitor PD current is converted to
the voltage with resistor and capacitor that has 1kHz to 10kHz
cut-off frequency.
VSS for BIAS current drive circuit.
BIAS current output. Sinks up to 54mA (typ) current.
BIAS current is adjusted with I-DAC2.
IBIAS voltage should be (VDD – 1.8V) or more.
VSS for BIAS current drive circuit.
VSS for MOD current drive circuit.
Positive MOD current output.
Sinks up to 85mA (typ) MOD current when input data is “H”.
MOD current is adjusted with I-DAC1.
IMOD voltage should be (VDD – 1.8V) or more.
Negative MOD current output.
Sinks MOD current when input data is “L”.
VSS for MOD current drive circuit.
Power supply for MOD current circuit.
No Connection. Connect to the VSS or leave open
Power supply for MOD driver circuit.
VSS for MOD driver circuit.
BIAS monitor current output.
Sources 0.0095 times current of I-DAC2 (BIAS) current.
BIASMON voltage should be 1.3V or less.
MOD Monitor current output.
Sources 0.0095 times current of I-DAC1 (modulation) current.
BIASMON voltage should be 1.3V or less.
Test input. Connect to VSS for normal operation
Test input. Connect to VSS for normal operation
Test input. Connect to VSS for normal operation
Test input. Connect to VSS for normal operation
Test input. Connect to VSS for normal operation
Test input. Leave open for normal operation.
PWR
PWR
Ai
PWR
Ao
PWR
PWR
Ao
Ao
PWR
PWR
PWR
PWR
Ao
Ao
Di
Di
Di
Di
Di
Do
Connect to
VSS.
Leave open
Center PAD of PKG should be connected to the VSS for good electrical performance and radiation of heat.
<MS0189-E-01>
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2004/5