ML12079
2.8 GHz Prescaler
MECL PLL Components
÷64/128/256 Prescaler
Legacy Device:
Motorola MC12079
The ML12079 is a single modulus divide by 64, 128, 256 prescaler
for low power frequency division of a 2.8 GHz (typical) high frequen-
cy input signal. Divide ratio control inputs SW1 and SW2 select the
required divide ratio of ÷64, ÷128, or ÷256.
An external load resistor is required to terminate the output. A 1.2
kΩ resistor is recommended to achieve a 1.6 Vpp output swing, when
dividing a 1.1 GHz input signal by the minimum divide ratio of 64,
assuming a 12 pF load. Output current can be minimized dependent
on conditions such as output frequency, capacitive load being driven,
and output voltage swing required. Typical values for load resistors
are included in the Vout specification for various divide ratios at 2.8
GHz input frequency.
•
•
•
•
2.8 GHz Toggle Frequency
Supply Voltage 4.5 to 5.5 V
Low Supply Current 9mA Typical at VCC = 5.0 V
Operating Temperature Range of TA = –40 to 85°C
8
1
SO 8 = -5P
PLASTIC PACKAGE
CASE 751
8
1
FUNCTIONAL TABLE
SW1
H
H
L
L
NOTE:
P DIP 8 = PP
PLASTIC PACKAGE
CASE 626
CROSS REFERENCE/ORDERING INFORMATION
MOTOROLA
PACKAGE
LANSDALE
P DIP 8
MC12079P
ML12079PP
SO 8
MC12079D
ML12079-5P
SW2
H
L
H
L
Divide Ratio
64
128
128
256
SW1 & SW2: H = VCC, L = Open.
Note:
Lansdale lead free (Pb) product, as it
becomes available, will be identified by a part
number prefix change from
ML
to
MLE.
MAXIMUM RATINGS
Characteristic
Power Supply Voltage, Pin 2
Operating Temperature Range
Storage Temperature Range
Maximum Output Current, Pin 4
Symbol
VCC
TA
Tstg
IO
Range
–0.5 to 7.0
–40 to 85
–65 to 150
4.0
Unit
Vdc
°C
°C
mA
IN
VCC
SW1
OUT
1
2
3
4
8
7
6
5
PIN CONNECTIONS
IN
NC
SW2
Gnd
(Top View)
Page 1 of 4
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Issue
ML12079
LANSDALE Semiconductor, Inc
ELECTRICAL CHARACTERISTICS
(VCC = 4.5 to 5.5 V; TA = –40 to 85°C, unless otherwise noted.)
Parameter
Toggle Frequency (Sine Wave)
Supply Current Output (Pin 2)
Input Voltage Sensitivity
Divide Ratio Control Input High (SW)
Divide Ratio Control Input Low (SW)
Output Voltage Swing
(CL = 12 pF; RL = 1.2 kΩ; IO = 2.7 mA)
1
(CL = 12 pF; RL = 2.2 kΩ; IO = 1.5 mA)
2
(CL = 12 pF; RL = 3.9 kΩ; IO = 0.85 mA)
3
250–500 MHz
500–2800 MHz
Symbol
ft
ICC
Vin
VIH
VIL
Vout
Min
0.25
–
400
100
VCC
Open
1.0
Typ
3.4
9.0
–
–
VCC
Open
1.6
Max
2.8
11.5
1000
1000
VCC
Open
–
Unit
GHz
mA
mVpp
V
–
Vpp
NOTES:
1. Divide ratio of
÷64
at 2.8 GHz.
2. Divide ratio of
÷128
at 2.8 GHz.
3. Divide ratio of
÷256
at 2.8 GHz.
Figure 1. Logic Diagram (ML12079)
D
In
In
C
QB
Q
D
C
Q
QB
D
C
QB
Q
D
C
Q
QB
D
C
QB
Q
D
C
SW2
SW1
QB
Q
D
C
QB
Q
D
C
QB
Q
Out
Figure 2. AC Test Circuit
VCC = 4.5 to 5.5 V
C3
SINE WAVE GENERATOR
C1
50
Ω
SW2
C2
IN
GND
OUT
CL
RL
EXTERNAL COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1
µF
CL = 12 pF (Including Scope and Jig Capacitance)
RL = 1.2 kΩ (for
÷64
at 2.8 GHz)
VCC
IN
SW1
Page 2 of 4
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Issue
ML12079
LANSDALE Semiconductor, Inc
Figure 3. Input Signal Amplitude versus Input Frequency
+15.0
+10.0
+5.0
0
–5.0
AMPLITUDE (dBm)
–10.0
–15.0
–20.0
–25.0
–30.0
–35.0
–40.0
–45.0
–50.0
0
400
800
1200
1600
2000
2400
2800
3200
FREQUENCY (MHz)
OPERATING
WINDOW
+1257.40
+707.11
+397.64
+223.61
+125.74
+70.71
mVrms
mVpp
+39.76
+22.36
+12.57
+7.07
+3.98
+2.24
+1.26
+0.71
3600
Divide Ratio = 64; VCC = 5.0 V; TA = 25°C
Figure 4. Output Amplitude versus Input Frequency
2000
1600
1200
800
400
0
3600
0
400
800
1200
1600
2000
2400
2800
3200
FREQUENCY (MHz)
Page 3 of 4
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Issue
ML12079
LANSDALE Semiconductor, Inc
OUTLINE DIMENSIONS
8
5
–B–
1
4
P DIP 8 = PP
PLASTIC PACKAGE
(ML12079PP)
CASE 626–05
ISSUE K
F
NOTE 2
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10
0.030
0.040
–A–
L
C
–T–
SEATING
PLANE
J
N
D
K
M
M
T A
B
H
G
0.13 (0.005)
M
M
A
8
D
5
SO 8 = -5P
PLASTIC PACKAGE
(ML12079-5P)
CASE 751–06
ISSUE T
C
E
1
4
H
0.25
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETER.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A
A1
B
C
D
E
e
H
h
L
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.19
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0
7
h
B
C
e
A
SEATING
PLANE
X 45
L
0.10
A1
B
0.25
M
C B
S
A
S
Lansdale
Semiconductor
reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale
Semiconductor
is a registered trademark of Lansdale
Semiconductor,
Inc.
Page 4 of 4
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Issue
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