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5962-9559503H9X

Description
SRAM Module, 128KX32, 85ns, CMOS, CQMA68, CERAMIC, LQFP-68
Categorystorage   
File Size396KB,10 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

5962-9559503H9X Overview

SRAM Module, 128KX32, 85ns, CMOS, CQMA68, CERAMIC, LQFP-68

5962-9559503H9X Parametric

Parameter NameAttribute value
MakerWhite Electronic Designs Corporation
package instructionCERAMIC, LQFP-68
Reach Compliance Codeunknown
Maximum access time85 ns
Other featuresUSER CONFIGURABLE AS 512K X 8
Spare memory width16
JESD-30 codeS-CQMA-G68
memory density4194304 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals68
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formGULL WING
Terminal locationQUAD
Base Number Matches1
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
n
Access Times of 70, 85, 100, 120ns
n
MIL-STD-883 Compliant Devices Available
n
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm
(0.140")(Package 502).
• 68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 4.57mm (0.140 inch)
high, (Package 510)
• 68 lead, Hermetic CQFP (G1U), 23.9mm
(0.940 inch) square, 4.57mm (0.140inch) high,
(Package 519)
n
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
n
Commercial, Industrial and Military Temperature
Ranges
n
5 Volt Power Supply
n
Low Power CMOS
n
TTL Compatible Inputs and Outputs
n
Built in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
n
Weight
WS128K32-XG1U - 5 grams typical
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
n
All devices are upgradeable to 512Kx32
4
SRAM MODULES
FIG. 1
PIN CONFIGURATION FOR WS128K32N-XH1X
TOP VIEW
PIN DESCRIPTION
34
I/O
15
I/O
14
I/O
13
I/O
12
OE
NC
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
V
CC
CS
4
WE
4
I/O
27
A
4
A
5
A
6
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
66
56
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
NC
I/O
0
I/O
1
I/O
2
11
12
WE
2
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
NC
I/O
3
22
23
I/O
0-31
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
September 2001 Rev. 3
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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