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ZL50415/GKC

Description
LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553
CategoryTelecom circuit   
File Size562KB,96 Pages
ManufacturerCONEXANT
Websitehttp://www.conexant.com/
Download Datasheet Parametric Compare View All

ZL50415/GKC Overview

LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553

ZL50415/GKC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerCONEXANT
Parts packaging codeBGA
package instructionHBGA, BGA553,29X29,50
Contacts553
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B553
length37.5 mm
Humidity sensitivity level1
Number of functions1
Number of terminals553
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHBGA
Encapsulate equivalent codeBGA553,29X29,50
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)225
power supply2.5,3.3 V
Certification statusNot Qualified
Maximum seat height2.46 mm
Nominal supply voltage2.5 V
surface mountYES
Telecom integrated circuit typesLAN SWITCHING CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width37.5 mm
Base Number Matches1
ZL50415
Unmanaged 16-Port 10/100M Layer-2
Ethernet Switch
Data Sheet
Features
Integrated Single-Chip 10/100M Ethernet Switch
• Sixteen 10/100 Mbps auto-negotiating Fast Ethernet
(FE) ports with RMII or GPSI (7WS) interface
options per port
April 2006
Ordering Information
ZL50415/GKC
ZL50415GKG2
553 Pin HSBGA
553 Pin HSBGA**
Supports one Frame Data Buffer (FDB) memory
domains
(1 MB or 2 MB)
with pipelined, sync-burst
SRAM at 100 MHz
• Applies centralized shared memory architecture
**Pb Free Tin/Silver/Copper
-40°C to 85°C
with 2 drop precedence levels
• Scheduling using delay bounded (DB), strict priority
(SP), and Weighted Fair Queuing (WFQ) disciplines
• User controlled WRED thresholds
• Buffer management: per-class, shared, and per-port
buffer reservations
L2 Switching
• MAC address self learning, up to 64K MAC
addresses
• Supports port-based VLAN
High performance packet classification and
switching at full-wire speed
CPU access supports the following interface
options:
• Serial interface in unmanaged mode, with optional
I
2
C EEPROM support
Classification based on:
• Port-based priority: priority in a frame can be
overwritten by the priority of port
• VLAN Priority field in VLAN tagged frame (IEEE
802.1p)
• DS/TOS field in IP packet
• UDP/TCP logical ports: 8 hard-wired and 8
programmable ports, including one programmable
range
Supports Ethernet multicasting and broadcasting
and flooding control
Supports per-system option to enable flow
control for best effort frames even on QoS-
enabled ports
QoS Support
• 4 transmission priorities for Fast Ethernet ports
• Per-queue weighted random early discard (WRED)
VLAN 1 MCT
The drop precedence of the above classifications
is programmable
Supports IEEE 802.3ad link aggregation
2
port trunking groups
Frame Data Buffer A
SRAM (1 M / 2 M)
FDB Interface
LED
FCB
Frame Engine
Search
Engine
MCT
Link
16 x 10/100M
RMII
Ports 0 - 15
Management
Module
Serial
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.

ZL50415/GKC Related Products

ZL50415/GKC ZL50415GKG2
Description LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553 LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, LEAD FREE, MS-034, HSBGA-553
Maker CONEXANT CONEXANT
Parts packaging code BGA BGA
package instruction HBGA, BGA553,29X29,50 HBGA,
Contacts 553 553
Reach Compliance Code compliant compli
JESD-30 code S-PBGA-B553 S-PBGA-B553
length 37.5 mm 37.5 mm
Humidity sensitivity level 1 1
Number of functions 1 1
Number of terminals 553 553
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HBGA HBGA
Package shape SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius) 225 260
Certification status Not Qualified Not Qualified
Maximum seat height 2.46 mm 2.46 mm
Nominal supply voltage 2.5 V 2.5 V
surface mount YES YES
Telecom integrated circuit types LAN SWITCHING CIRCUIT LAN SWITCHING CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30
width 37.5 mm 37.5 mm
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