IC 1K X 8 OTPROM, 55 ns, CDFP24, CERAMIC, FP-24, Programmable ROM
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 55 ns |
| JESD-30 code | R-CDFP-F24 |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 2.286 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 9.144 mm |
| Base Number Matches | 1 |
| 82S181A/BKA | 82S181A/B3A | 82S181A/BJA | |
|---|---|---|---|
| Description | IC 1K X 8 OTPROM, 55 ns, CDFP24, CERAMIC, FP-24, Programmable ROM | IC 1K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM | IC 1K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM |
| Maker | NXP | NXP | NXP |
| Parts packaging code | DFP | QLCC | DIP |
| package instruction | DFP, | QCCN, | DIP, |
| Contacts | 24 | 28 | 24 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 55 ns | 55 ns | 55 ns |
| JESD-30 code | R-CDFP-F24 | S-CQCC-N28 | R-GDIP-T24 |
| memory density | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 24 | 28 | 24 |
| word count | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 1KX8 | 1KX8 | 1KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | QCCN | DIP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.286 mm | 1.905 mm | 5.715 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL |
| width | 9.144 mm | 11.43 mm | 15.24 mm |
京公网安备 11010802033920号
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