82S129/BEA datasheet, PDF - EEWORLD Datasheet

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82S129/BEA: DescriptionIC 256 X 4 OTPROM, 60 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM; Categorystorage; File Size68KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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82S129/BEA Overview

IC 256 X 4 OTPROM, 60 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM

82S129/BEA Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	16
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	60 ns
JESD-30 code	R-GDIP-T16
length	19.535 mm
memory density	1024 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	16
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X4
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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82S129/BEA Related Products

	82S129/BEA	82S126/BEA	82S126/BFA	82S129/BFA
Description	IC 256 X 4 OTPROM, 60 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM	IC 256 X 4 OTPROM, 60 ns, CDIP16, 0.300 INCH, CERAMIC, DIP-16, Programmable ROM	IC 256 X 4 OTPROM, 60 ns, CDFP16, CERAMIC, FP-16, Programmable ROM	IC 256 X 4 OTPROM, 60 ns, CDFP16, CERAMIC, FP-16, Programmable ROM
Maker	NXP	NXP	NXP	NXP
Parts packaging code	DIP	DIP	DFP	DFP
package instruction	DIP,	DIP,	DFP,	DFP,
Contacts	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	60 ns	60 ns	60 ns	60 ns
JESD-30 code	R-GDIP-T16	R-GDIP-T16	R-CDFP-F16	R-CDFP-F16
memory density	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
word count	256 words	256 words	256 words	256 words
character code	256	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	256X4	256X4	256X4	256X4
Output characteristics	3-STATE	OPEN-COLLECTOR	OPEN-COLLECTOR	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DFP	DFP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	FLATPACK	FLATPACK
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	2.159 mm	2.159 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	6.731 mm	6.731 mm
Base Number Matches	1	1	1	1

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