Package information - SOT23F
Surface mounted, 3 pin package
Package outline
D
b
b
L1
L
c
e1
e
E1
E
b
R
A
A1
Dim.
A
A1
b
c
D
e
e1
Millimeters
Min.
0.80
0.00
0.35
0.10
2.80
1.80
Max.
1.00
0.10
0.45
0.20
3.00
2.00
Inches
Min.
0.0315
0.00
0.0153
0.0043
0.1102
0.0709
Max.
0.0394
0.0043
0.0161
0.0079
0.1181
0.0787
Dim.
E
E1
L
L1
R
O
-
Millimeters
Min.
2.30
1.50
0.48
0.30
0.05
0°
-
Max.
2.50
1.70
0.68
0.50
0.15
12°
-
Inches
Min.
0.0906
0.0590
0.0189
0.0153
0.0019
0°
-
Max.
0.0984
0.0669
0.0268
0.0161
0.0059
12°
-
0.95 ref
0.0374 ref
Note:
Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 4 - May 2007
© Zetex Semiconductors plc 2007
1
www.zetex.com
Package information - SOT23F
Nominal weight
Nominal weight per device 11.6mg.
Tape and reel information
Orientation
Tape width
(mm)
8
Reel size
(inches)
7
No. of
components
3,000
Tape option
indicator
TA
Embossed carrier tape configuration
P0
K
t
Top cover
tape
10 pitches culmulative
tolerance on tape
±0.2mm (±0.008”)
D
P2
E
See Note 1
A0
See Note 1
F
W
B1
K0
See Note 1
B0
P
Embossment
Center lines
of cavity
D1
User direction of feed
Dimensions
mm (inches)
A0, B0, K0
B1 (max.)
D
D1 (max.)
E
F
P
Tape size (mm)
8
See note
*
4.55 (0.179)
1.50 + 0.10 - 0.00
1.00 (0.039)
1.75 ± 0.10
3.50 ± 0.10
(0.138 ± 0.004)
4.00 ±0.10
(0.157 ± 0.004)
12
See note
*
8.20 (0.323)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
5.50 ± 0.05
(0.217 ± 0.002)
4.00 ±0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
16
See note
*
12.10 (0.476)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
7.50 ± 0.10
(0.295 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
12.00 ± 0.10
(0.472 ± 0.004)
4.00 ± 0.10
2.00 ± 0.05
0.40
16.30 (0.642)
24
See note
*
20.10 (0.791)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
11.50 ± 0.10
(0.453 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
to 20.00 ± 0.10
(0.787 ± 0.004)
in 4.00 (0.157)
increments
4.00 ± 0.10
2.00 ± 0.05
0.40
24.30 (0.957)
P0
P2
t (max.)
W
4.00 ± 0.10
2.00 ± 0.05
0.40
8.00 (0.315)
4.00 ± 0.10
2.00 ± 0.05
0.40
12.00 ± 0.30
(0.472 ± 0.012)
NOTES:
* A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements
(see fig. 1).
Issue 4 - May 2007
© Zetex Semiconductors plc 2007
2
www.zetex.com
Package information - SOT23F
0.5mm
maximum
20° maximum
Component
cavity
center line
0.5mm
maximum
20° maximum
B0
Component
center line
A0
Sketch A (top view)
Component lateral movement
Sketch B (side or front sectional view)
Component rotation - side view
Sketch C (top view)
Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core
for tape start.
2.5mm min. width,
10mm min. depth
T
B
A
D
N
C
Full radius
G
Tape option
TA
TC
A max.
179 (7.047)
330 (12.992)
B min.
1.5 (0.06)
G
C
13.00 - 13.02
(0.512 - 0.52)
D min.
25.0 (0.984)
20.2 (0.795)
T max.
N min.
50 (1.969)
Tape size
8mm
12mm
16mm
24mm
8.4 -9.9 (0.33 - 0.39)
12.4 -16.4 (0.49 - 0.569)
16.4 -18.4 (0.65 - 0.729 )
24.4 - 26.4 (0.96 – 1.039)
14.4 (0.567)
18.4 (0.724)
22.4 (0.882)
30.4 (1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 4 - May 2007
© Zetex Semiconductors plc 2007
3
www.zetex.com
51mcu
京公网安备 11010802033920号
EEWORLD
