Multiline Transient Voltage Surge Suppressor
RoHS
MLN SurgeArray
™
Suppressor
The MLN SurgeArray
™
Suppressor is designed to help protect compo-
nents from transient voltages that exist at the circuit board level. This
device provides four independent suppressors in a single leadless chip
in order to reduce part count and placement time as well as save space
on printed circuit boards.
SurgeArray
™
devices are intended to suppress ESD, EFT and other
transients in order to protect integrated circuits or other sensitive
components operating at any voltage up to 18VDC. SurgeArray devices
are rated to the IEC 61000-4-2 human body model ESD to help products
attain EMC compliance. The array offers excellent isolation and low
crosstalk between sections.
The inherent capacitance of the SurgeArray Suppressor permits it to
function as a filter/suppressor, thereby replacing separate zener/
capacitor combinations.
The MLN array is manufactured using the Littelfuse Multilayer technology
process and is similar to the Littelfuse ML and MLE Series of discrete
leadless chips.
The MLN can also be provided in a Dual version. Contact Littelfuse
for information.
Features
• RoHS Compliant
• Four Individual Devices in One Chip
• ESD Rated to IEC 61000-4-2 (Level 4)
• AC Characterized for Impedance and Capacitance
• Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ)
• Low Leakage
• Operating Voltage up to 18VM(DC)
• -55
o
C to 125
o
C Operating Temperature Range
• Low-Profile, PCMCIA Compatible
Size
Metric
2012
3216
EIA
0805
1206
Applications
• Data, Diagnostic I/O Ports
• Analog Signal/Sensor Lines
• Portable/Hand-Held Products
• Mobile Communications/Cellular Phones
• Computer/DSP Products
• Industrial Instruments Including Medical
180
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Multiline Transient Voltage Surge Suppressor
RoHS
MLN SurgeArray
™
Suppressor
V
C
O
C
O
Absolute Maximum Ratings
For ratings of individual members of a series, see device ratings and specifications table.
Continuous:
Steady State Applied Voltage: DC Voltage Range (VM(DC)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125
Storage Temperature Range (TSTG). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150
Device Ratings and Specifications Any Single Section
MAX RATINGS (125
o
C)
MAXIMUM
NON-
REPETITIVE
MAXIMUM
SURGE
CONTINUOUS
CURRENT
WORKING
(8/20µs)
VOLTAGE
V
M(DC)
I
TM
MAXIMUM
NON-
REPETITIVE
SURGE
ENERGY
(10/1000
µs)
W
TM
PERFORMANCE SPECIFICATIONS (25
o
C)
MAXIMUM
CLAMPING
VOLTAGE
(AT NOTED
8/20µs)
CURRENT
V
C
(NOTE 2)
(NOTE 3)
8kV CONTACT 15kV AIR
Peak Clamp
(V)
NEW
Peak
(V)
90
45
75
85
170
100
130
V
N(DC)
MIN
V
N(DC)
MAX
(NOTE 4)
C
TYP
(pF)
220
430
250
140
75
100
45
MAX
(pF)
300
520
300
175
100
125
75
(A)
20
30
30
30
20
30
30
(J)
0.05
0.1
0.1
0.1
0.05
0.1
0.05
(V)
19 at 1A
15.5 at 2A
23 at 2A
30 at 2A
50 at 1A
40 at 2A
50 at 1A
(V)
140
60
95
110
260
165
200
(V)
40
35
50
55
100
63
95
(V)
7.1
7.1
11.0
15.9
22.0
22.0
25.0
(V)
10.8
10.8
16.0
20.3
28.0
28.0
35.0
V5.5MLN40805
V5.5MLN41206
V9MLN41206
V14MLN41206
5.5
5.5
9
14
18
18
18
NEW
V18MLN40805
V18MLN41206
V18MLN41206L
NOTES:
1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit.
2. Direct discharge to device terminals (IEC preffered test method).
3. Corona discharge through air (represents actual ESD event)
4. Capacitance may be customized, contact Sales.
For applications exceeding 125
o
C ambient temperature, the peak surge
current and energy ratings must be reduced as shown in Figure 1.
PERCENT OF PEAKVALUE
Temperature Derating
100
90
50
100
PERCENT OF RATED VALUE
90
80
70
60
50
40
30
20
10
0
-55
50
60
70
80
90
100
110 120
130 140 150
10
O
1
t
t
1
t
2
TIME
O
1
= VIRTUAL ORIGIN OFWAVE
t = TIME FROM 10% TO 90% OF PEAK
t
1
= VIRTUAL FRONT TIME = 1.25 x t
t
2
= VIRTUALTIME TO HALFVALUE
(IMPULSE DURATION)
EXAMPLE:
FOR AN 8/20µs CURRENT
WAVEFORM:
8µs = t
1
= VIRTUAL FRONT
TIME
20µs = t
2
= VIRTUAL TIME TO
HALF VALUE
AMBIENT TEMPERATURE (
o
C)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE
F
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181
SURFACE MOUNT
PART
NUMBER
TYPICAL
ESD SUPPRESSION
VOLTAGE (NOTE 1)
NOMINAL
VOLTAGE AT
1mA DC
CURRENT
CAPACITANCE
AT
1MHz (1V p-p)
3
Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
RoHS
MLN SurgeArray
™
Suppressor
Any Single Section
100
V18
V18
MAXIMUM STANDBY
MAXIMUM CLAMP VOLTAGE
Typical Performance Curves
25
20
V5.5
Varistor Voltage (V)
10000
V14
NOMINAL VOLTAGE
V
NOM
(V)
15
V9
10
10
V5.5
5
0
0
10
100
NUMBER OF DISCHARGES
1000
1
0.00001 0.0001
0.001
0.01
0.1
1
10
100
FIGURE 3. NOMINAL VOLTAGE STABILITYTO IEC 1000-4-2
(8kV CONTACT METHOD, ONE SECTION)
Current (A)
FIGURE 4. V-I CHARACTERISTIC, 0805 SIZE
100
V18L
100
MAXIMUM CLAMP VOLTAGE
V18
MAXIMUM STANDBY
V14
V9
1
NUMBER OF SURGES
100
Varistor Voltage (V)
SSurge Current (A)
V5.5
V18L
V18
V14
2
10
10
10
3
10
V9
1
∞
10
4
V5.5
10
5
10
6
1
0.00001
0.1
10
0.0001
0.001
0.01
0.1
1
10
100
100
1000
10000
Square Wave Impulse Duration (µs)
FIGURE 6. 0805 SIZE PULSE RATING FOR LONG DURATION SURGES
(ANY SINGLE SECTION)
Current (A)
FIGURE 5. V-I CHARACTERISTIC, 1206 SIZE
100
500
NUMBER OF SURGES
1
100
2
V5.5
400
Surge Current (A)
10
10
Capacitance (pF)
10
3
300
V9
200
V14
V18
1
∞
10
4
10
5
10
6
100
V18L
0.1
10
100
1000
10000
0
0.1
1
10
100
1000
Square Wave Impulse Duration (µs)
FIGURE 7. 1206 SIZE PULSE RATING FOR LONG DURATION SURGES
(ANY SINGLE SECTION)
Frequency (MHz)
FIGURE 8. CAPACITANCE vs FREQUENCY
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Multiline Transient Voltage Surge Suppressor
RoHS
MLN SurgeArray
™
Suppressor
Any Single Section (Continued)
10000
Typical Performance Curves
400E-12
350E-12
1000
300E-12
Parallel Capacitance, Cp (F)
5.5V
250E-12
Parallel Capacitance, Cp (F)
100
200E-12
10
5.5V
18V
150E-12
3
SURFACE MOUNT
1000
100E-12
18V
1
50E-12
000E+0
1.0E+06
1.0E+07
1.0E+08
1.0E+09
0.1
1.0E+06
1.0E+07
1.0E+08
1.0E+09
1.0E+10
Frequency (Hz)
FIGURE 9. CAPACITANCE VS. FREQUENCY, 0805 SIZE
Frequency (Hz)
FIGURE 10. IMPEDENCE VS FREQUENCY, 0805 SIZE
1000
100
OHMS
10
1
0.1
1MHz
10MHz
100MHz
1GHz
10GHz
Frequency
FIGURE 11. CAPACITANCE VS FREQUENCY, 1206 SIZE
10000
0
-20
1000
Impeance |Z| ( )
100
Crosstalk (dB)
-40
V5.5
V9
-60
V14
V18
V18L
10
V14
V18
V18L
-80
V5.5
V9
1
-100
V
IN
= 1V
RMS
Z = 50
0.1
0.1
1
10
100
1000
-120
0.001
0.01
0.1
1
10
100
Frequency (MHz)
FIGURE 12. IMPEDANCE vs FREQUENCY, 1206 SIZE
Frequency (MHz)
FIGURE 13. ADJACENT CHANNEL CROSSTALK
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183
Multiline Transient Voltage Surge Suppressor
RoHS
MLN SurgeArray
™
Suppressor
230
230
Soldering Recommendations
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are IR Re-flow & Wave soldering. Typical profiles are
shown in Figures 14 & 15
The recommended solder for the MLN SurgeArray suppressor is a
62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also rec-
ommends an RMA solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled.
When using a reflow process, care should be taken to ensure that the
MLN chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solderís peak
temperature is essential to minimize thermal shock.
TEMPERATURE (
o
C)
o
C)
TEMPERATURE (
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 14. REFLOW SOLDER PROFILE
300
300
250
250
200
200
150
150
100
100
50
50
0
00.0
0.0
0.5
0.5
1.0
1.0
1.5
2.0
2.5
3.0
TIME (MINUTES) 3.0
1.5
2.0
2.5
TIME (MINUTES)
3.5
3.5
4.0
4.0
4.5
4.5
SECOND PREHEAT
SECOND PREHEAT
FIRST PREHEAT
FIRST PREHEAT
MAXIMUM WAVE 260
o
C
MAXIMUM WAVE 260
o
C
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause
of thermal shock is hot printed circuit boards being removed from the
solder process and subjected to cleaning solvents at room temperature.
The boards must be allowed to cool gradually to less than 50˚C before
cleaning.
Lead-Free (Pb-free) Soldering Recommendations
Littelfuse offers the 0805 array as the preferred solution for lead-free sol-
dering conditions.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but
there is a wide selection of pastes & fluxes available with which the nick-
el barrier parts should be compatible.
The reflow profile must be constrained by maximums shown in Figure16.
For Pb-free Wave soldering, Figure 15 still applies.
Note: the Pb-free paste, flux & profile were used for evaluation purposes
by Littelfuse, based upon industry standards & practices. There are
multiple choices of all three available, it is advised that the customer
explores the optimum combination for their process as processes vary
considerably from site to site.
FIGURE 15. WAVE SOLDER PROFILE
FIGURE 15. WAVE SOLDER PROFILE
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s RATE
60 - 150 SEC
RAMP
<3˚C/s
60 > 150 SEC
- 217˚C
> 217˚C
PREHEAT ZONE
PREHEAT ZONE
5.0
5.0
6.0
6.0
7.0
7.0
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
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