80C52/BQA datasheet, PDF - EEWORLD Datasheet

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80C52/BQA: DescriptionIC 8-BIT, MROM, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller; CategoryMicrocontrollers and processors; File Size330KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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80C52/BQA Overview

IC 8-BIT, MROM, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller

80C52/BQA Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Is Samacsys	N
Has ADC	NO
Address bus width	16
bit size	8
maximum clock frequency	12 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-GDIP-T40
Number of I/O lines	32
Number of terminals	40
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PWM channel	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
ROM programmability	MROM
Maximum seat height	5.715 mm
Maximum slew rate	35 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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Description	IC 8-BIT, MROM, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller	IC 8-BIT, MROM, 12 MHz, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller	IC 8-BIT, MROM, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller	IC 8-BIT, 12 MHz, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller	IC 8-BIT, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller	IC 8-BIT, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller	IC 8-BIT, MICROCONTROLLER, CQCC44, CERAMIC, QFP-44, Microcontroller	IC 8-BIT, MROM, MICROCONTROLLER, CDIP40, CERAMIC, DIP-40, Microcontroller
Parts packaging code	DIP	QFP	QFP	QFP	DIP	DIP	QFP	DIP
package instruction	DIP,	QCCJ,	QCCJ,	QCCJ,	DIP,	DIP,	QCCJ,	DIP,
Contacts	40	44	44	44	40	40	44	40
Reach Compliance Code	unknown	unknow	unknow	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Has ADC	NO	NO	NO	NO	NO	NO	NO	NO
Address bus width	16	16	16	16	16	16	16	16
bit size	8	8	8	8	8	8	8	8
maximum clock frequency	12 MHz	12 MHz	16 MHz	12 MHz	16 MHz	12 MHz	16 MHz	16 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
External data bus width	8	8	8	8	8	8	8	8
JESD-30 code	R-GDIP-T40	S-CQCC-J44	S-CQCC-J44	S-CQCC-J44	R-GDIP-T40	R-GDIP-T40	S-CQCC-J44	R-GDIP-T40
Number of I/O lines	32	32	32	32	32	32	32	32
Number of terminals	40	44	44	44	40	40	44	40
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
PWM channel	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCJ	QCCJ	QCCJ	DIP	DIP	QCCJ	DIP
Package shape	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	4.83 mm	4.83 mm	4.83 mm	5.715 mm	5.715 mm	4.83 mm	5.715 mm
Maximum slew rate	35 mA	35 mA	39 mA	35 mA	39 mA	35 mA	39 mA	39 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
surface mount	NO	YES	YES	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	J BEND	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL
width	15.24 mm	16.4465 mm	16.4465 mm	16.4465 mm	15.24 mm	15.24 mm	16.4465 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1	1	1	1	1	1	1
Maker	NXP	-	-	NXP	NXP	NXP	NXP	-

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