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89HPES24T6G2ZCBLI

Description
PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size571KB,54 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES24T6G2ZCBLI Overview

PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676

89HPES24T6G2ZCBLI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction27 X 27 MM, 1 MM PITCH, FCBGA-676
Contacts676
Reach Compliance Codecompliant
ECCN code3A001.A.3
Is SamacsysN
Bus compatibilityPCI
maximum clock frequency125 MHz
JESD-30 codeS-PBGA-B676
JESD-609 codee0
length27 mm
Number of terminals676
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA676,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1,3.3 V
Certification statusNot Qualified
Maximum seat height3.22 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width27 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
24-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES24T6G2
Data Sheet
Device Overview
The 89HPES24T6G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T6G2 is a 24-lane, 6-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and up to five
downstream ports and supports switching between downstream ports.
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to six switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
Features
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
6-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 54
2013 Integrated Device Technology, Inc.
April 30, 2013
DSC 6930

89HPES24T6G2ZCBLI Related Products

89HPES24T6G2ZCBLI 89HPES24T6G2ZCBL 89HPES24T6G2ZCBLGI 89HPES24T6G2ZCBLG
Description PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676
Is it lead-free? Contains lead Contains lead Lead free Lead free
Is it Rohs certified? incompatible incompatible conform to conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA
package instruction 27 X 27 MM, 1 MM PITCH, FCBGA-676 27 X 27 MM, 1 MM PITCH, FCBGA-676 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676
Contacts 676 676 676 676
Reach Compliance Code compliant compliant compliant compliant
ECCN code 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3
Is Samacsys N N N N
Bus compatibility PCI PCI PCI PCI
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B676 S-PBGA-B676 S-PBGA-B676 S-PBGA-B676
JESD-609 code e0 e0 e3 e3
length 27 mm 27 mm 27 mm 27 mm
Number of terminals 676 676 676 676
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Encapsulate equivalent code BGA676,26X26,40 BGA676,26X26,40 BGA676,26X26,40 BGA676,26X26,40
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 225 260 260
power supply 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.22 mm 3.22 mm 3.22 mm 3.22 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn)
Terminal form BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30
width 27 mm 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1
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