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88K8483BRI

Description
Microprocessor Circuit, PBGA672, ROHS COMPLIANT, FCBG-672
CategoryMicrocontrollers and processors   
File Size2MB,162 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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88K8483BRI Overview

Microprocessor Circuit, PBGA672, ROHS COMPLIANT, FCBG-672

88K8483BRI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionROHS COMPLIANT, FCBG-672
Contacts672
Reach Compliance Codenot_compliant
ECCN code5A991
Is SamacsysN
JESD-30 codeS-PBGA-B672
JESD-609 codee1
length27 mm
Humidity sensitivity level4
Number of terminals672
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA672,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1.2,1.5,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height3.22 mm
Maximum supply voltage1.32 V
Minimum supply voltage1.08 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
Base Number Matches1
SPI-4 Exchange
Document Issue 1.0
IDT88K8483
Description
The IDT88K8483 is a 3-port SPI-4 Exchange device. The IDT SPI-4
Exchange devices build on IDT’s proven SPI-4 implementation and
packet fragment processor (PFP) design. The IDT88K8483 suits appli-
cations with slow backpressure response and other advanced
networking applications when there is the need for duplicate ports to re-
route data multiple times through the packet-exchange and temporary
storage for complete in-flight packets.
The data on each SPI-4 interface logical port (LP) are mapped to a
logical identifier (LID). A data flow between logical port addresses on the
various interfaces is accomplished using LID maps that can be dynami-
cally reconfigured. The device enables the connection of two SPI-4
devices to a network processor having one or more SPI-4 interfaces. Up
to 18Mbit of additional buffer memory can be provided using the QDRII
interface. Alternatively, the HSTL I/O may be used to provide a generic
packet interface to a FPGA. The device supports a maximum of 128
logical ports.
Features
Functionality
– Multiplexes logical ports (LPs) from SPI-4A and SPI-4B to SPI-
4M
– Optionally converts between interleaved packet transfers and
whole packet transfers per logical port
– Data redirection per LP between SPI-4A, SPI-4B and 10G
FPGA
– Per LP configurable memory allocation
– Per LP memory expansion via QDR-II SRAM interface
– 3 separate clock generators allowing fully flexible, fully inte-
grated clock derivations and generation
Standard Interfaces
– Two OIF SPI-4 phase 2: 80 - 450 MHz, 256 address range, 64
concurrently active LPs per interface
– One OIF SPI-4 phase 2: 80 - 450 MHz, 256 address range,
128 concurrently active LPs
– SPI-4 FIFO status channel options:
– LVDS full-rate, LVDS quarter-rate, LVTTL quarter-rate
– SPI-4 compatible with Network Processor Streaming Interface
(NPSI NPE-Framer mode of operation)
– HSTL Interface with selectable operating mode
160 - 200 MHz DDR packet interface, 64 concurrently active
LPs; or
QDR-II memory interface: 160 - 200MHz HSTL
– Serial or parallel microprocessor interface for control and
monitoring
– IEEE 1491.1 JTAG
Applications
Ethernet transport
SONET / SDH packet transport line cards
Broadband aggregation
Multi-service switches
IP services equipment
Security firewalls
Block Diagram
Auxiliary
10Gbps
Interface
QDR-II 10Gbps
Memory int.
10Gbps FPGA
Packet Int.
Serial / 8bit
MicroprocessorInterface
Micro.
Int.
Tributary
SPI-4s
SPI-4A
64 Logical
Ports
Packet Fragment
Processor A-TM (PFP)
Packet Fragment
Processor A-MT (PFP)
Packet Fragment
Processor B-TM (PFP)
Packet Fragment
Processor B-MT (PFP)
JTAG Interface
Figure 1 IDT88K8483 Block Diagram
SPI-4M
128 Logical
Ports
Main
SPI-4
SPI-4B
64 Logical
Ports
JTAG Int.
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc.
1 of 162
©
2006 Integrated Device Technology, Inc.
October 20, 2006
DSC 6214/-

88K8483BRI Related Products

88K8483BRI IDT88K8483BRI IDT88K8483BLI
Description Microprocessor Circuit, PBGA672, ROHS COMPLIANT, FCBG-672 Microprocessor Circuit, PBGA672, ROHS COMPLIANT, FCBG-672 Microprocessor Circuit, PBGA672, FCBG-672
Is it lead-free? Lead free Lead free Contains lead
Is it Rohs certified? conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA
package instruction ROHS COMPLIANT, FCBG-672 ROHS COMPLIANT, FCBG-672 BGA, BGA672,26X26,40
Contacts 672 672 672
Reach Compliance Code not_compliant not_compliant not_compliant
JESD-30 code S-PBGA-B672 S-PBGA-B672 S-PBGA-B672
JESD-609 code e1 e1 e0
length 27 mm 27 mm 27 mm
Number of terminals 672 672 672
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA672,26X26,40 BGA672,26X26,40 BGA672,26X26,40
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 225
power supply 1.2,1.5,2.5,3.3 V 1.2,1.5,2.5,3.3 V 1.2,1.5,2.5,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 3.22 mm 3.22 mm 3.22 mm
Maximum supply voltage 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.08 V 1.08 V 1.08 V
Nominal supply voltage 1.2 V 1.2 V 1.2 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30
width 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Is Samacsys N N -
Humidity sensitivity level 4 4 -
Base Number Matches 1 1 -

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