EEWORLDEEWORLDEEWORLD

Part Number

Search

82V8313BBG

Description
Framer, PBGA208, 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208
CategoryWireless rf/communication    Telecom circuit   
File Size703KB,140 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
Download Datasheet Parametric Compare View All

82V8313BBG Overview

Framer, PBGA208, 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208

82V8313BBG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instruction17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208
Contacts208
Reach Compliance Codecompliant
Is SamacsysN
JESD-30 codeS-PBGA-B208
JESD-609 codee1
length17 mm
Humidity sensitivity level3
Number of functions1
Number of terminals208
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.97 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesFRAMER
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width17 mm
Base Number Matches1
3.3 VOLT M13 MULTIPLEXER
IDT82V8313
Version 3
June 3, 2004
2975 Stender Way, Santa Clara, California 95054
Telephone: (800) 345-7015 • • FAX: (408) 492-8674
Printed in U.S.A.
© 2004 Integrated Device Technology, Inc.

82V8313BBG Related Products

82V8313BBG IDT82V8313BBG 82V8313DSG 82V8313BB
Description Framer, PBGA208, 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 Framer, PBGA208, 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 Framer, PQFP208, 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208 Framer, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208
Is it Rohs certified? conform to conform to conform to incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA QFP BGA
package instruction 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-208 28 X 28 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFP-208 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208
Contacts 208 208 208 208
Reach Compliance Code compliant compliant compliant not_compliant
Is Samacsys N N N N
JESD-30 code S-PBGA-B208 S-PBGA-B208 S-PQFP-G208 S-PBGA-B208
JESD-609 code e1 e1 e3 e0
length 17 mm 17 mm 28 mm 17 mm
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 208 208 208 208
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA FQFP BGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 260 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.97 mm 1.97 mm 4.1 mm 1.97 mm
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
Telecom integrated circuit types FRAMER FRAMER FRAMER FRAMER
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER Matte Tin (Sn) Tin/Lead (Sn63Pb37)
Terminal form BALL BALL GULL WING BALL
Terminal pitch 1 mm 1 mm 0.5 mm 1 mm
Terminal location BOTTOM BOTTOM QUAD BOTTOM
Maximum time at peak reflow temperature 30 30 30 20
width 17 mm 17 mm 28 mm 17 mm
Base Number Matches 1 1 1 1
How to measure the eye diagram
I have an Ethernet switch and the teacher asked me to measure the Ethernet eye diagram. I need help with the measurement method and steps....
wzk07296 Analog electronics
Now we have an award section, so can we have an event section?
The award-giving area is indeed very convenient, and all the content is clear at a glance. Suddenly, I thought that there could also be a special area for activities, so that it would be convenient to...
mmmllb Suggestions & Announcements
Raspberry Pi + Lego bricks turn into a supercomputer
[align=left][font=Verdana][color=#000000][backcolor=white]Recently, a group of computer engineers from the University of Southampton successfully built a supercomputer for the first time using 64 Rasp...
wstt Creative Market
The pinnacle of contemporary light shaping—digital semiconductor lighting (I)
The pinnacle of contemporary light shaping—digital semiconductor lighting (I) Author: Anhui Yunlong Technology Company Zhang Ke Yuan Xun Digital semiconductor lighting is a new opportunity and a new c...
ahylkj LED Zone
Electronic Technology Courseware
[i=s]This post was last edited by paulhyde on 2014-9-15 09:34[/i] A rare digital electronic courseware, worth saving...
yinongqi Electronics Design Contest
Please tell me where the application is located? Used to solve the problem Language Files (*.txt, *.tgz) are missing!
lang_chs.txt and lang_std.txt should be copied to the same directory as the application. I have tried almost all directories, but it doesn't seem to work. Where is the application directory? Or is the...
colyli Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 326  2925  2723  483  973  7  59  55  10  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号